Curable heat-conductive adhesive agent

Abstract

The curable thermally conductive adhesive of the present invention comprises a curable binder and a thermally conductive filler, wherein a cured product obtained by curing the curable thermally conductive adhesive at 60° C. for 24 hours has an adhesion of 0.3 MPa or more, and the following expression (1) is satisfied when G′ represents a storage elastic modulus, tan δ represents a loss tangent, and the storage elastic modulus and the loss tangent are obtained by subjecting the cured product to dynamic viscoelasticity measurement under conditions having a temperature of 25° C. and a frequency of 0.1 Hz. The present invention can provide a curable thermally conductive adhesive capable of forming a thermally conductive member that has strong adhesion to an adherend and unlikely peels off from the adherend even after undergoing thermal cycling between low and high temperatures. log ⁢ 10 ⁢ ( G ′ ) < 4.29 × tan ⁢ δ + 6 Expression ⁢ ( 1 )

Dependencies are inferred from the claim text.