Binder resin for resin transfer molding preforms

A resin transfer molding preform binder resin comprising:

• a) at least one aromatic polyepoxide;
• b) a fluorene epoxide different than the aromatic epoxide and having the following structure:
• ##STR6## wherein each R.sup.0 is independently selected from the group consisting of hydrogen, halogen, linear and branched alkyl groups having 1 to 6 carbon atoms, aromatic groups, nitro groups, acetyl groups, and trimethylsilyl groups;
• each R.sup.1 is independently selected from the group consisting of hydrogen, halogen, aromatic groups, and linear and branched alkyl groups having 1 to 6 carbon atoms;
• and
• each R.sup.2 is independently a terminal epoxy functionalized alkyl group having 1 to 6 carbon atoms;
• and
• c) a 9,9-bis(aminophenyl)fluorene curing agent for crosslinking the polyepoxide and the fluorene epoxide;
• wherein the binder resin is a solid, room temperature stable, essentially nonsintering powder, and further wherein the uncured binder resin displays a glass transition temperature greater than about 40.degree. C.