C08G 59/223
Together with monoepoxy compounds
Official title: {together with monoepoxy compounds}
C08G59/223 (Together with monoepoxy compounds) appears on 59 US grants and 133 published applications in this corpus.
Search patents in C08G- Granted patents
- 59
- Published applications
- 133
- Assignees
- 81
- Inventors
- 305
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2011 | 0 | 1 |
| 2012 | 0 | 5 |
| 2013 | 0 | 1 |
| 2014 | 1 | 2 |
| 2015 | 1 | 7 |
| 2016 | 3 | 3 |
| 2017 | 5 | 9 |
| 2018 | 2 | 5 |
| 2019 | 8 | 6 |
| 2020 | 3 | 8 |
| 2021 | 5 | 8 |
| 2022 | 7 | 15 |
| 2023 | 3 | 15 |
| 2024 | 8 | 15 |
| 2025 | 8 | 13 |
| 2026 | 5 | 20 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Methods of treating unconsolidated sand formations using a red mud sealant composition6 Oct 2026US 12,753,339 B2Saudi Arabian Oil Company
- Cationic epoxy compositions4 Aug 2026US 12,698,359 B2Henkel AG & Co. KGaA
- Silicone free thermal interface material with reactive diluent28 Apr 2026US 12,614,779 B2Henkel AG & Co. KGaA
- Epoxy composition comprising a bio-based epoxy compound31 Mar 2026US 12,590,207 B2Henkel AG & Co. KGaA
- Network toughening of additively manufactured, high glass transition temperature materials via sequentially cured, interpenetrating polymers10 Feb 2026US 12,545,755 B2Rowan University
- Implantable medical devices with photocurable feedthrough potting adhesives and methods of manufacture17 Sep 2026US 2026/0273289 A1
- Epoxy-based uv-vis-curable encapsulant compositions13 Aug 2026US 2026/0234322 A1Sicpa Holding SA
- Thermally conductive resin composition and thermally conductive member13 Aug 2026US 2026/0237781 A1Sekisui Chemical Co., Ltd.
- Curable heat-conductive adhesive agent6 Aug 2026US 2026/0226324 A1Sekisui Chemical Co., Ltd.
- Curable thermally conductive adhesive and thermally conductive member6 Aug 2026US 2026/0226325 A1Sekisui Chemical Co., Ltd.
Most cited
By later US patents
- Electrochromic multi-layer devices with cross-linked ion conducting polymer16US 9,720,299 B1Kinestral Technologies, Inc. · 2017
- Epoxy mortar adapted in bridge expansion joint and construction method thereof6US 9,822,499 B2Heeron Tech(Wuhan)New Materials Co.,Ltd. · 2017
- Degradable and recyclable epoxy conductive adhesive as well as preparing, degrading and recycling methods therefor3US 10,240,074 B2Shengyi Technology Co., Ltd. · 2019
- Amine for low-emission epoxy resin compositions2US 10,287,388 B2Sika Technology Agh · 2019
- Epoxy-based LCM compositions with controlled viscosity and methods of treating a lost circulation zone of a wellbore2US 11,370,956 B2Saudi Arabian Oil Company · 2022