Thermally conductive resin composition and thermally conductive member

Abstract

A thermally conductive resin composition comprising a polyfunctional epoxy resin (A), an amine curing agent (B), and a thermally conductive filler (C), the polyfunctional epoxy resin (A) being an epoxy resin that has an aromatic ring and is a liquid at 23° C. or an epoxy resin having a molecular weight of 600 or less, the amine curing agent (B) having an amino group (b1) selected from the group consisting of primary amino groups and secondary amino groups, carbon atom(s) bonded to the nitrogen atom constituting the amino group (b1), not forming a ring structure, at least one of the carbon atom(s) being bonded to another carbon atom and an atom other than a hydrogen atom.

Dependencies are inferred from the claim text.