Silicone free thermal interface material with reactive diluent

A thermal interface formed from a two-part composition comprising:

• a first component having a first reactant with a reactive functionality of one or two, the first component exhibiting a viscosity of less than 500,000 cP at 1 s-1 and 20° C.
• a second component having a second reactant that is reactable with the first reactant without cross-linking, the second reactant having with a reactive functionality of:
• (i) one or two if the first reactant functionality is one or two;
• and
• (ii) three or more only if the first reactant functionality is one,
• wherein the second component exhibits a viscosity of less than 500 Pas at 1 s−1;
• a non-silicone cross-linkable silyl-modified polymer resin;
• and
• thermally conductive filler,
• wherein the first and second reactants do not participate in a cross-linking reaction of the non-silicone silyl-modified polymer resin, but are reactable with one another to form a product having a viscosity of at least 1000 Pas at 1 s−1 at 20° C., and wherein the thermal interface exhibits a thermally conductivity of at least 1 W/m*K.