C08F 290/145
Polyamides
Official title: {Polyamides; Polyesteramides; Polyimides}
C08F290/145 (Polyamides) appears on 41 US grants and 40 published applications in this corpus.
Search patents in C08F- Granted patents
- 41
- Published applications
- 40
- Assignees
- 30
- Inventors
- 128
- Latest grant
- 2 Sep 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 3 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 3 | 1 |
| 2003 | 0 | 4 |
| 2004 | 2 | 3 |
| 2005 | 3 | 2 |
| 2006 | 1 | 1 |
| 2007 | 0 | 0 |
| 2008 | 1 | 1 |
| 2009 | 1 | 1 |
| 2010 | 1 | 8 |
| 2011 | 3 | 2 |
| 2012 | 4 | 2 |
| 2013 | 0 | 0 |
| 2014 | 1 | 1 |
| 2015 | 4 | 0 |
| 2016 | 1 | 1 |
| 2017 | 0 | 0 |
| 2018 | 0 | 2 |
| 2019 | 2 | 2 |
| 2020 | 2 | 0 |
| 2021 | 1 | 1 |
| 2022 | 0 | 2 |
| 2023 | 0 | 1 |
| 2024 | 1 | 1 |
| 2025 | 1 | 4 |
By publication year. Applications have been published since 2001.
Recent patents
- Poly(amide-imide) copolymer, composition and polymer film comprising thereof2 Sep 2025US 12,404,371 B2LG Chem.Ltd.
- Manufacturing method for cured substance, manufacturing method for laminate, and manufacturing method for semiconductor device, and treatment liquid19 Mar 2024US 11,934,102 B2FUJIFILM Corporation
- Photosensitive resin composition, and polymer film made therefrom23 Feb 2021US 10,928,730 B2Zhen Ding Technology Co., Ltd.
- Polyimide precursor composition, photosensitive resin composition, cured film, method for producing cured film, a semiconductor device, and method for producing polyimide precursor composition21 Jan 2020US 10,538,627 B2FUJIFILM Corporation
- Precursor composition, photosensitive resin composition, method for producing precursor composition, cured film, method for producing cured film, and semiconductor device7 Jan 2020US 10,526,448 B2FUJIFILM Corporation
- Resin composition, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, and semiconductor device11 Dec 2025US 2025/0376552 A1FUJIFILM Corporation
- Resin composition, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, and semiconductor device24 Jul 2025US 2025/0236697 A1FUJIFILM Corporation
- Resin composition, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, and semiconductor device17 Jul 2025US 2025/0230283 A1FUJIFILM Corporation
- Resin composition, cured substance, laminate, manufacturing method for cured substance, manufacturing method for laminate, manufacturing method for semiconductor device, and semiconductor device20 Feb 2025US 2025/0059347 A1FUJIFILM Corporation
- Negative-type photosensitive polymer, polymer solution, negative-type photosensitive resin composition, cured film, and semiconductor device12 Sep 2024US 2024/0301115 A1Sumitomo Bakelite Co., Ltd.
Most cited
By later US patents
- Polyimide polymer with oligomeric silsesquioxane51US 7,619,042 B2NeXolve Corporation · 2009
- Polymeric coating for protecting objects45US 8,053,492 B2NeXolve Corporation · 2011
- Reflective film for thermal control43US 8,048,938 B2NeXolve Corporation · 2011
- Polymeric coating for the protection of objects41US 8,309,627 B2NeXolve Corporation · 2012
- Active energy ray curable composition comprised of a maleimide derivative and a method for curing the said curable composition31US 6,410,611 B1Dainippon Ink and Chemicals, Inc. · 2002