Polyimide precursor composition, photosensitive resin composition, cured film, method for producing cured film, a semiconductor device, and method for producing polyimide precursor composition

A method for producing a polyimide precursor composition, comprising:

• reacting a compound represented by General Formula (P) with a compound represented by General Formula (Q) to produce a diester or a diamide;
• and
• reacting the diester or the diamide with a compound represented by General Formula (R),
• wherein the reaction for producing the diester or the diamide is carried out at 40° C. to 80° C. for 3 to 10 hours,
• in General Formula (P), R112 represents a single bond or a divalent organic group;
• HA3-R115 General Formula (Q)
• in General Formula (Q), A3's each independently represent an oxygen atom or NH, and R115 represents a monovalent organic group;
• and
• H2N—R111—NH2 General Formula (R)
• in General Formula (R), R111 represents a divalent organic group,
• wherein the polyimide precursor composition comprises a polyimide precursor including repeating units represented by General Formula (1-1), and
• the molar ratio of repeating units represented by General Formula (1-2) among the structural isomers of the polyimide precursor is 60% to 90% by mole,
• in General Formulae (1-1) and (1-2), A1 and A2 each independently represents an oxygen atom or NH, R111 and R112 each independently represents a single bond or a divalent organic group, and R113 and R114 each independently represents a hydrogen atom or a monovalent organic group.