C08F 290/144
Polymers containing more than one epoxy group per molecule
Official title: {Polymers containing more than one epoxy group per molecule}
C08F290/144 (Polymers containing more than one epoxy group per molecule) appears on 55 US grants and 22 published applications in this corpus.
Search patents in C08F- Granted patents
- 55
- Published applications
- 22
- Assignees
- 43
- Inventors
- 150
- Latest grant
- 21 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 1 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
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| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
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| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 2 | 0 |
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| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 2 | 0 |
| 2001 | 4 | 0 |
| 2002 | 3 | 1 |
| 2003 | 1 | 1 |
| 2004 | 3 | 1 |
| 2005 | 0 | 2 |
| 2006 | 0 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 0 |
| 2009 | 1 | 4 |
| 2010 | 1 | 2 |
| 2011 | 1 | 1 |
| 2012 | 3 | 0 |
| 2013 | 0 | 1 |
| 2014 | 1 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 3 |
| 2023 | 0 | 2 |
| 2024 | 2 | 1 |
| 2025 | 2 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board21 Apr 2026US 12,606,662 B2Resonac Corporation
- Fiber-reinforced molding material and molded article using same8 Apr 2025US 12,269,912 B2DIC Corporation
- Surface treatment film, manufacturing method therefor, and article1 Apr 2025US 12,264,217 B2Dainichiseika Color & Chemicals Mfg. Co., Ltd.
- Photosensitive resin composition, photosensitive resin film, printed wiring board, semiconductor package, and method for producing printed wiring board1 Oct 2024US 12,103,999 B2Resonac Corporation
- Two-component type curable resin composition, product, dry film, cured product, and printed wiring board23 Jul 2024US 12,043,754 B2Taiyo Holdings Co., Ltd.
- Curable resin and methods for producing curable resin intermediate, curable resin, curable resin composition, and cured product10 Sep 2026US 2026/0265446 A1Nippon Shokubai Co., Ltd.
- Recess filling material kit, cured product thereof, and recess filling method15 May 2025US 2025/0154361 A1Resonac Corporation
- Radically polymerizable resin composition18 Jul 2024US 2024/0239940 A1Resonac Corporation
- Surface treatment film, manufacturing method therefor, and article2 Nov 2023US 2023/0348654 A1Dainichiseika Color & Chemicals Mfg. Co., Ltd.
- Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring board28 Sep 2023US 2023/0303750 A1Showa Denko Materials Co., Ltd.
Most cited
By later US patents
- Energy-polymerization adhesive, coating, film and process for making the same128US 5,252,694 AMinnesota Mining and Manufacturing Company · 1993
- High modulus polymers and composites from plant oils97US 6,121,398 AUniversity of Delaware · 2000
- Water-dispersible polymer and coating composition containing the same80US 5,830,952 AThe Dexter Corporation · 1998
- Water-dispersible polymer and coating composition containing the same72US 5,922,817 AThe Dexter Corporation · 1999
- Aqueous coating composition62US 6,306,934 B1Imperial Chemical Industries PLC · 2001