C08F 283/085
On to unsaturated polyphenylene oxides
Official title: {on to unsaturated polyphenylene oxides}
C08F283/085 (On to unsaturated polyphenylene oxides) appears on 9 US grants and 23 published applications in this corpus.
Search patents in C08F- Granted patents
- 9
- Published applications
- 23
- Assignees
- 18
- Inventors
- 70
- Latest grant
- 26 Mar 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2006 | 0 | 2 |
| 2007 | 1 | 0 |
| 2008 | 0 | 2 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 2 |
| 2014 | 1 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 0 |
| 2017 | 1 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 1 |
| 2020 | 1 | 1 |
| 2021 | 3 | 2 |
| 2022 | 0 | 2 |
| 2023 | 1 | 1 |
| 2024 | 1 | 1 |
| 2025 | 0 | 4 |
| 2026 | 0 | 2 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Polyphenylene ether resin composition, prepreg, metal-clad laminate26 Mar 2024US 11,939,443 B2Nippon Soda Co., Ltd.
- Resin composition and article made therefrom12 Dec 2023US 11,840,628 B2Elite Material Co., Ltd.
- Resin composition and article made therefrom7 Sep 2021US 11,111,383 B2Elite Material Co., Ltd.
- Resin composition and article made therefrom20 Jul 2021US 11,066,552 B2Elite Electronic Material (Zhongshan) Co., Ltd.
- Prepolymerized resin and use thereof12 Jan 2021US 10,889,672 B2Elite Electronic Material (Kunshan) Co., Ltd.
- Resin composition, cured product in which resin composition is used, prepreg, printed wiring board, and electronic component for high frequencies3 Sep 2026US 2026/0258240 A1Namics Corporation
- Graft polyarylether copolymers26 Mar 2026US 2026/0085142 A1Solvay Specialty Polymers USA, LLC
- Resin composition and article made therefrom13 Nov 2025US 2025/0346701 A1Elite Material Co., Ltd.
- High heat deflection temperature ductile photopolymerizable material and additive manufacturing methods30 Oct 2025US 2025/0333558 A1Ford Global Technologies, LLC
- Resin composition, dry film, and cured product2 Oct 2025US 2025/0304748 A1Taiyo Holdings Co., Ltd.
Most cited
By later US patents
- Curable resin composition4US 8,703,277 B2Asahi Kasei E-Materials Corporation · 2014
- Curable encapsulant composition, device including same, and associated method2US 7,297,370 B2General Electric Company · 2007
- Prepolymerized resin and use thereof1US 10,889,672 B2Elite Electronic Material (Kunshan) Co., Ltd. · 2021
- Resin composition and article made therefrom1US 11,111,383 B2Elite Material Co., Ltd. · 2021