C08F 283/08
On to polyphenylene oxides
Official title: on to polyphenylene oxides
C08F283/08 (On to polyphenylene oxides) appears on 122 US grants and 87 published applications in this corpus.
Search patents in C08F- Granted patents
- 122
- Published applications
- 87
- Assignees
- 72
- Inventors
- 320
- Latest grant
- 7 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 3 | 0 |
| 1979 | 4 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 5 | 0 |
| 1989 | 5 | 0 |
| 1990 | 5 | 0 |
| 1991 | 4 | 0 |
| 1992 | 5 | 0 |
| 1993 | 6 | 0 |
| 1994 | 5 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 0 |
| 2002 | 0 | 1 |
| 2003 | 0 | 6 |
| 2004 | 6 | 3 |
| 2005 | 0 | 8 |
| 2006 | 3 | 5 |
| 2007 | 6 | 2 |
| 2008 | 3 | 8 |
| 2009 | 3 | 2 |
| 2010 | 5 | 6 |
| 2011 | 0 | 1 |
| 2012 | 4 | 1 |
| 2013 | 1 | 2 |
| 2014 | 3 | 0 |
| 2015 | 0 | 1 |
| 2016 | 0 | 2 |
| 2017 | 3 | 1 |
| 2018 | 0 | 1 |
| 2019 | 2 | 3 |
| 2020 | 2 | 2 |
| 2021 | 4 | 7 |
| 2022 | 2 | 4 |
| 2023 | 2 | 4 |
| 2024 | 5 | 5 |
| 2025 | 1 | 7 |
| 2026 | 1 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Compound, mixture, curable resin composition and cured product thereof, and method for producing compound7 Apr 2026US 12,595,334 B2Nippon Kayaku Kabushiki Kaisha
- Resin composition and filter element28 Jan 2025US 12,209,202 B2Advanced Echem Materials Company Limited
- Antenna member6 Aug 2024US 12,057,627 B1Asahi Kasei Kabushiki Kaisha
- Thermosetting resin composition, resin sheet, laminate, and printed wiring board11 Jun 2024US 12,006,433 B2Panasonic Intellectual Property Management Co., Ltd.
- Resin composition and filter element4 Jun 2024US 11,999,868 B2eChem Solutions Corp.
- Resin composition, cured product in which resin composition is used, prepreg, printed wiring board, and electronic component for high frequencies3 Sep 2026US 2026/0258240 A1Namics Corporation
- Reprocessable and degradable bismaleimide resin16 Jul 2026US 2026/0201114 A1Soochow University
- Compound, mixture, curable resin composition and cured product thereof, and method for producing compound9 Jul 2026US 2026/0193409 A1Nippon Kayaku Kabushiki Kaisha
- Curable resin composition, dry film, cured product, and printed wiring board30 Apr 2026US 2026/0122792 A1Taiyo Holdings Co., Ltd.
- Graft polyarylether copolymers26 Mar 2026US 2026/0085142 A1Solvay Specialty Polymers USA, LLC
Most cited
By later US patents
- Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom94US 6,812,276 B2General Electric Company · 2004
- Curable polyphenylene ether resin composition and a cured resin composition obtainable therefrom88US 5,218,030 AAsahi Kasei Kogyo Kabushiki Kaisha · 1993
- Flame-retardant resin compositions65US 3,936,414 AFMC Corporation · 1976
- Thermoplastic polyamide--polyphenylene ether compositions56US 4,732,938 ABorg-Warner Chemicals, Inc. · 1988
- Glycidyl-epoxy-acrylic copolymers53US 5,157,078 AThe Glidden Company · 1992