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US 12,006,433 B2Granted
Thermosetting resin composition, resin sheet, laminate, and printed wiring board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsKouichi Aoki, Tomoyuki Aoki, Eiichiro Saito
Life of this patent
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Abstract
The thermosetting resin composition contains a radical polymerizable unsaturated compound and an organic radical compound.
Claims11
A thermosetting resin composition comprising:
- a radical polymerizable unsaturated compound (A);
- an organic radical compound (C), and
- a styrene-based elastomer (E);
- the radical polymerizable unsaturated compound (A) containing:
- a copolymer (A1) having a structural unit derived from mono-olefin and a structural unit derived from diene;
- and
- a terminal modified polyphenylene ether compound (A2), and
- a content of the elastomer (E) falling within the range from 5 parts by mass to 100 parts by mass with respect to 100 parts by mass in total of the copolymer (A1) and the compound (A2).
5 more elements
Dependencies are inferred from the claim text.