Polyphenylene ether resin composition, prepreg, metal-clad laminate
AssigneeNippon Soda Co., Ltd.
InventorsShota Osumi, Izumi Tando, Hiroki Ueda, Yoshio Hayakawa
Life of this patent
Estimating the term…
Abstract
A polyphenylene ether resin composition includes (A) polyphenylene ether, and (B) a block copolymer including a butadiene block having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure of 80:20 to 100:0 and a styrene block. The number average molecular weight (Mn) of the component (A) may be 1,000 to 7,000, the weight ratio of the styrene block to the butadiene block in the component (B) may be 10:90 to 80:20, and the weight average molecular weight (Mw) of the component (B) may be 2,000 to 100,000.
Claims10
A polyphenylene ether resin composition comprising (A) polyphenylene ether, and (B) a styrene-butadiene-styrene block copolymer (SBS) having a molar ratio of a 1,2-bonding structure to a 1,4-bonding structure in a butadiene block of 80:20 to 100:0, wherein
- a number average molecular weight (Mn) of the component (A) is 1,000 to 5,000, and
- a weight average molecular weight (Mw) of the component (B) is 2,000 to 100,000.
Dependencies are inferred from the claim text.