US 7,297,370 B2 · Curable encapsulant composition, device including same, and associated method

Abstract

An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionalized polymer and at least one reactive monomer composition. The reactive monomer composition may include a reactive monomer component that may be a low temperature solid and may be present in an amount in the reactive monomer composition a range of greater than about 20 weight percent based on the total weight of reactive monomer composition. The mixture, at about low temperature, may be solid or tack-free, or both solid and tack-free.

Claims2

Dependent claims

A method of encapsulating at least a portion of an electronic or optical device, comprising:

melting at least a portion of pellets or powder, the portion comprising a mixture of a functionalized polymer and a reactive monomer composition, the reactive monomer composition comprising at least one reactive monomer that is both a solid up to about 100 degrees Celsius and present in the reactive monomer composition in an amount in a range of greater than about 20 weight percent based on the total weight of the reactive monomer composition, and the pellets or powder being solid or tack-free, or both solid and tack-free at a temperature that is up to about 100 degrees Celsius;
and
flowing the molten portion into contact with the portion of the electronic or optical device.

Dependencies are inferred from the claim text.

Facts

Application

11/167,843Filed 24 Jun 2005 · continuation in part

Priority

22 Dec 2004

Published

US 2006/0135704 A122 Jun 2006

Granted

20 Nov 2007

Term ends

Not estimatedThe source records don’t support an estimate.

Classification20 codes

C08F 290/06
On to polymers modified by introduction of unsaturated end groups: polymers provided for in subclass C08G
C08F 283/08
On to polyethers, polyoxymethylenes or polyacetals: on to polyphenylene oxides
C08F 283/085
On to polyphenylene oxides: on to unsaturated polyphenylene oxides
C08F 290/062
Polymers provided for in subclass C08G: polyethers

Curable encapsulant composition, device including same, and associated method

Life of this patent

Curable encapsulant composition, device including same, and associated method

Life of this patent

Abstract

Claims2