C08F 267/10
On to polymers of amides or imides
Official title: on to polymers of amides or imides
C08F267/10 (On to polymers of amides or imides) appears on 36 US grants and 35 published applications in this corpus.
Search patents in C08F- Granted patents
- 36
- Published applications
- 35
- Assignees
- 32
- Inventors
- 99
- Latest grant
- 6 May 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 1 | 3 |
| 2004 | 0 | 0 |
| 2005 | 1 | 2 |
| 2006 | 0 | 2 |
| 2007 | 0 | 0 |
| 2008 | 1 | 0 |
| 2009 | 0 | 1 |
| 2010 | 2 | 4 |
| 2011 | 2 | 1 |
| 2012 | 3 | 1 |
| 2013 | 0 | 1 |
| 2014 | 1 | 0 |
| 2015 | 0 | 2 |
| 2016 | 1 | 2 |
| 2017 | 1 | 1 |
| 2018 | 0 | 2 |
| 2019 | 1 | 2 |
| 2020 | 5 | 3 |
| 2021 | 2 | 4 |
| 2022 | 0 | 0 |
| 2023 | 1 | 1 |
| 2024 | 1 | 1 |
| 2025 | 1 | 2 |
By publication year. Applications have been published since 2001.
Recent patents
- Zwitterionic double network hydrogels6 May 2025US 12,291,652 B2University of Washington
- Maleimide resin, curable resin composition, and cured product thereof16 Apr 2024US 11,958,940 B2Nippon Kayaku Kabushiki Kaisha
- Acrylic dispersants with fused aromatic imide anchor groups16 May 2023US 11,649,309 B2Lubrizol Advanced Materials, Inc.
- Control of polymer architectures by living ring-opening metathesis copolymerization6 Jul 2021US 11,053,356 B2California Institute of Technology
- Modified copolymer, method for preparing the same, and method for preparing paste23 Mar 2021US 10,954,329 B2Industrial Technology Research Institute
- Dry film11 Sep 2025US 2025/0285785 A1Fujifilm Electronic Materials U.S.A., Inc.
- Resin composition, article made therefrom and use thereof24 Jul 2025US 2025/0236738 A1Elite Electronic Material (Kunshan) Co., Ltd.
- Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device29 Aug 2024US 2024/0287347 A1Mitsubishi Gas Chemical Company, Inc.
- Dry Film23 Feb 2023US 2023/0053355 A1Fujifilm Electronic Materials U.S.A., Inc.
- Control of polymer architectures by living ring-opening metathesis copolymerization23 Dec 2021US 2021/0395463 A1California Institute of Technology
Most cited
By later US patents
- Water-soluble high polymers and their preparation44US 4,138,446 ASumitomo Chemical Company, Limited · 1979
- Heat resistant resin compositions, articles and method17US 5,464,949 AGeneral Electric Company · 1995
- Thermosettable resin composition containing alkenyl phenyl cyanate15US 4,600,760 AThe Dow Chemical Company · 1986
- Polymers from ethylenic monomers15US 4,931,510 ABayer Aktiengesellschaft · 1990
- Biocidal polystyrene hydantoin particles13US 6,548,054 B2Auburn University · 2003