Maleimide resin, curable resin composition, and cured product thereof
AssigneeNippon Kayaku Kabushiki Kaisha
InventorsKenichi Kuboki, Masataka Nakanishi, Kazuki Matsuura
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Abstract
Provided is a maleimide resin with superior solution stability. Also provided is a cured product with a superior dielectric characteristic that is obtained by curing a curable resin composition in which said maleimide resin is used. The maleimide resin expressed in formula (1), wherein the N,N′-(phenylene-di-(2,2,-propylidene)-di-p-phenylene) bismaleimide content is 90 area % or less. (In formula (1), n is the number of repetitions, and 1<n<5.)
Claims14
A maleimide resin represented by following Formula (1) and in which a content (A1) of the component having n=1 in formula (1) as determined by GPC analysis, a content (A2) of N,N′-(phenylene-di-(2,2-propylidene)-di-p-phenylene)bismaleimide in the component having n=1 as determined by HPLC analysis, a content of N,N′-(phenylene-di-(2,2-propylidene)-di-p-phenylene)bismaleimide from the calculation formula of (A1)×(A2) is 90 area % or less:
- in Formula (1), n represents the number of repetitions, and 1≤n<5.
A maleimide resin represented by following Formula (2) and in which a content of N,N′-(1,3-phenylene-di-(2,2-propylidene)-di-p-phenylene)bismaleimide is 90 area % or less:
- in Formula (2), n represents a number of repetitions, and 1≤n<5.
Dependencies are inferred from the claim text.