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US 2023/0053355 A1Published application
Dry Film
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorsSanjay Malik, William A. Reinerth, Binod B. De
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Abstract
This disclosure relates to a dry film structure that includes a carrier substrate; and a dielectric film supported by the carrier substrate. The dielectric film includes at least one dielectric polymer and low amounts of metals.
Claims31
A dry film structure, comprising:
- a carrier substrate;
- and
- a dielectric film supported by the carrier substrate, the dielectric film comprising at least one dielectric polymer,
- wherein the total amount of aluminum, chromium, cobalt, copper, iron, magnesium, manganese, nickel, silver, and zinc in the dielectric film is less than about 300 ppb of the dielectric film and the amount of each of these metals in the dielectric film is less than about 100 ppb of the dielectric film.
1 more element
A dry film structure, comprising:
- a carrier substrate;
- and
- a dielectric film supported by the carrier substrate, the dielectric film comprising at least one dielectric polymer,
- wherein the total amount of aluminum, calcium, chromium, cobalt, copper, iron, magnesium, manganese, nickel, potassium, silver, sodium, and zinc in the dielectric film is less than about 500 ppb of the dielectric film.
1 more element
Dependencies are inferred from the claim text.