C08F 20/32
Containing epoxy radicals
Official title: containing epoxy radicals
C08F20/32 (Containing epoxy radicals) appears on 42 US grants and 50 published applications in this corpus.
Search patents in C08F- Granted patents
- 42
- Published applications
- 50
- Assignees
- 47
- Inventors
- 163
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 0 | 0 |
| 1985 | 2 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 0 |
| 2002 | 1 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 1 | 1 |
| 2011 | 0 | 0 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 1 | 3 |
| 2015 | 0 | 2 |
| 2016 | 1 | 1 |
| 2017 | 1 | 1 |
| 2018 | 3 | 1 |
| 2019 | 1 | 9 |
| 2020 | 3 | 7 |
| 2021 | 5 | 3 |
| 2022 | 5 | 5 |
| 2023 | 2 | 4 |
| 2024 | 3 | 7 |
| 2025 | 2 | 1 |
| 2026 | 3 | 3 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor device having air gap and method for manufacturing the same19 May 2026US 12,635,511 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Stretchable resin composition, and resin sheet material, metal foil with resin, metal-clad laminate, and wiring board each including or obtained using same14 Apr 2026US 12,600,815 B2Panasonic Intellectual Property Management Co., Ltd.
- Curable composition20 Jan 2026US 12,528,893 B2Threebond Co., Ltd.
- Resin composition, resin film using same, metal foil with resin, metal-clad laminate, and wiring board12 Aug 2025US 12,384,862 B2Panasonic Intellectual Property Management Co., Ltd.
- Ink composition, window using the same, and manufacturing method of window using the same18 Feb 2025US 12,227,658 B2Samsung Display Co., Ltd.
- Protein based coupling agent for carbon fibers10 Sep 2026US 2026/0265500 A1BYK-Chemie GmbH
- Semiconductor device having air gap and method for manufacturing the same27 Aug 2026US 2026/0255941 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Methods of forming a semiconductor device23 Jul 2026US 2026/0215233 A1
- Composition For Forming Adhesive Film And Patterning Process24 Jul 2025US 2025/0237955 A1Shin-Etsu Chemical Co., Ltd.
- Stretchable resin composition, and resin sheet material, metal foil with resin, metal-clad laminate, and wiring board each including or obtained using same26 Dec 2024US 2024/0425642 A1Panasonic Intellectual Property Management Co., Ltd.
Most cited
By later US patents
- Glycidyl methacrylate polymers, their preparation and solvolysis products42US 4,388,448 AE. I. Du Pont de Nemours and Company · 1983
- Process for producing a curable resin from cyanate ester compound and unsaturated 1,2-epoxy compound14US 4,533,727 AMitsubishi Gas Chemical Company, Inc. · 1985
- Emulsion and dispersion comprising cross-linked polymeric microgel prepared from polymerizing epoxy-containing monomer in the presence of an acid10US 4,611,026 APPG Industries, Inc. · 1986
- Embolic compositions with non-cyanoacrylate rheology modifying agents9US 7,687,053 B2Boston Scientific Scimed, Inc. · 2010
- Process for preparing highly-cured transparent resin molded products8US 4,010,088 AJapan Atomic Energy Research Institute · 1977