Stretchable resin composition, and resin sheet material, metal foil with resin, metal-clad laminate, and wiring board each including or obtained using same
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsTomohiro Fukao, Tomoaki Sawada, Takatoshi Abe
Life of this patent
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Abstract
An aspect of the present invention relates to a stretchable resin composition containing an epoxy resin and a curing agent, in which the epoxy resin has a weight average molecular weight of 50,000 or more and 3,000,000 or less and a polydispersity of average molecular weights (Mw/Mn) that satisfies the following Formula (1): 1.1≤Mw/Mn≤3.0(1) (wherein, Mn represents a number average molecular weight and Mw represents a weight average molecular weight), the curing agent is a crystalline compound, and a glass transition temperature of a cured product of the stretchable resin composition is 60° C. or less.
Claims13
A stretchable resin composition comprising:
- an epoxy resin;
- and
- a curing agent,
- wherein the epoxy resin has
- a weight average molecular weight of 50,000 or more and 3,000,000 or less, and
- a polydispersity of average molecular weights (Mw/Mn) that satisfies the following Formula (1):
- 2.
- ≤
- Mw
- /
- Mn
- ≤
- 3.
- (
- 1
- )
- wherein, Mn represents a number average molecular weight and Mw represents a weight average molecular weight in formula (1),
- the curing agent is a crystalline compound, and
- a glass transition temperature of a cured product of the stretchable resin composition is 60° C. or less.
Dependencies are inferred from the claim text.