Resin composition, resin film using same, metal foil with resin, metal-clad laminate, and wiring board
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsTomohiro Fukao, Tomoaki Sawada, Kyosuke Michigami
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Abstract
An aspect of the present invention relates to a resin composition containing an acrylic resin and a curing agent, in which the acrylic resin contains a polymerization unit (A) of a (meth)acrylate having an epoxy group, a polymerization unit (B) of a (meth)acrylate having a cyano group, and a polymerization unit (C) of a (meth)acrylate having an isobornyl group, a weight average molecular weight of the acrylic resin is 50,000 or more and 3,000,000 or less, and a storage modulus of a cured product of the resin composition at 200° C. is 0.1 MPa or more and 3.5 MPa or less.
Claims15
A resin composition comprising:
- an acrylic resin and a curing agent,
- wherein the acrylic resin contains a polymerization unit (A) of a (meth)acrylate having an epoxy group, a polymerization unit (B) of acrylonitrile or methacrylonitrile, and a polymerization unit (C) of a (meth)acrylate having an isobornyl group,
- a weight average molecular weight of the acrylic resin is 50,000 or more and 3,000,000 or less, and
- a storage modulus of a cured product of the resin composition at 200° C. is 0.1 MPa or more and 3.5 MPa or less.
Dependencies are inferred from the claim text.