C04B 41/5194
Metallisation of multilayered ceramics
Official title: {Metallisation of multilayered ceramics, e.g. for the fabrication of multilayer ceramic capacitors}
C04B41/5194 (Metallisation of multilayered ceramics) appears on 19 US grants and 8 published applications in this corpus.
Search patents in C04B- Granted patents
- 19
- Published applications
- 8
- Assignees
- 15
- Inventors
- 61
- Latest grant
- 11 Feb 2020
Filings by year
| Year | Granted patents | Published applications |
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| 1988 | 1 | 0 |
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| 2015 | 0 | 1 |
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| 2017 | 1 | 1 |
| 2018 | 1 | 1 |
| 2019 | 1 | 1 |
| 2020 | 1 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 0 |
| 2024 | 0 | 0 |
| 2025 | 0 | 3 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Process for manufacturing a leadless feedthrough for an active implantable medical device11 Feb 2020US 10,559,409 B2Greatbatch Ltd.
- Process for manufacturing a leadless feedthrough for an active implantable medical device2 Apr 2019US 10,249,415 B2Greatbatch Ltd.
- Methods of fabricating a polycrystalline diamond compact17 Jul 2018US 10,022,843 B2US Synthetic Corporation
- Methods of fabricating polycrystalline diamond and polycrystalline diamond compacts4 Apr 2017US 9,610,555 B2US Synthetic Corporation
- Method for manufacturing laminated-ceramic electronic components26 Nov 2002US 6,485,591 B1Matsushita Electric Industrial Co., Ltd.
- Inorganic particle dispersed slurry composition and method for producing inorganic sintered body9 Jul 2026US 2026/0193140 A1Sekisui Chemical Co., Ltd.
- Multilayer ceramic electronic component and method of manufacturing the same20 Nov 2025US 2025/0357047 A1Taiyo Yuden Co., Ltd.
- Multilayer ceramic capacitor and method of manufacturing the same5 Jun 2025US 2025/0182969 A1Samsung Electro-Mechanics Co., Ltd.
- Release film and method for manufacturing multilayer electronic component using the same27 Mar 2025US 2025/0104915 A1Samsung Electro-Mechanics Co., Ltd.
- Process for manufacturing a leadless feedthrough for an active implantable medical device8 Aug 2019US 2019/0244729 A1Greatbatch Ltd.
Most cited
By later US patents
- Method of manufacturing ceramic electronic device57US 4,766,671 ANEC Corporation · 1988
- Method of making a planar multi-layer capacitor32US 5,639,507 AAVX Corporation · 1997
- Method for manufacturing laminated-ceramic electronic components31US 6,485,591 B1Matsushita Electric Industrial Co., Ltd. · 2002
- Methods of fabricating polycrystalline diamond and polycrystalline diamond compacts25US 9,610,555 B2US Synthetic Corporation · 2017
- Process for fabricating a multilayer ceramic circuit board23US 5,300,163 AAsahi Glass Company, Limited · 1994