C04B 2237/74
Forming laminates or joined articles comprising at least two different interlayers separated
Official title: Forming laminates or joined articles comprising at least two different interlayers separated by a substrate
C04B2237/74 (Forming laminates or joined articles comprising at least two different interlayers separated) appears on 58 US grants and 45 published applications in this corpus.
Search patents in C04B- Granted patents
- 58
- Published applications
- 45
- Assignees
- 49
- Inventors
- 154
- Latest grant
- 17 Feb 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 2 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 4 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 1 |
| 2002 | 3 | 2 |
| 2003 | 2 | 1 |
| 2004 | 1 | 1 |
| 2005 | 0 | 1 |
| 2006 | 2 | 0 |
| 2007 | 0 | 1 |
| 2008 | 0 | 1 |
| 2009 | 1 | 2 |
| 2010 | 2 | 3 |
| 2011 | 1 | 1 |
| 2012 | 3 | 4 |
| 2013 | 0 | 0 |
| 2014 | 2 | 0 |
| 2015 | 1 | 0 |
| 2016 | 1 | 4 |
| 2017 | 2 | 3 |
| 2018 | 3 | 2 |
| 2019 | 4 | 4 |
| 2020 | 3 | 0 |
| 2021 | 1 | 3 |
| 2022 | 2 | 2 |
| 2023 | 2 | 4 |
| 2024 | 2 | 3 |
| 2025 | 6 | 1 |
| 2026 | 1 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Process for producing a metal-ceramic substrate, and a metal-ceramic substrate produced using such a method17 Feb 2026US 12,552,722 B2Rogers Germany GmbH
- Preparation method for copper plate-covered silicon nitride ceramic substrate8 Jul 2025US 12,351,524 B2Shanghai Institute of Ceramics, Chinese Academy of Sciences
- Positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance and preparation method therefor8 Jul 2025US 12,354,774 B2Jiangsu New Linzhi Electronic Technology Co., Ltd.
- Bonded assembly, and ceramic circuit substrate and semiconductor device using the same4 Mar 2025US 12,240,218 B2Kabushiki Kaisha Toshiba
- Joining techniques for composite ceramic bodies28 Jan 2025US 12,211,685 B2Lam Research Corporation
- Monolithic functional ceramic element and method for producing a contact for a functional ceramic5 Mar 2026US 2026/0066155 A1
- Joining techniques for composite ceramic bodies10 Apr 2025US 2025/0115522 A1Lam Research Corporation
- Joining techniques for composite ceramic bodies14 Nov 2024US 2024/0379316 A1Lam Research Corporation
- Positive temperature coefficient ceramic thermistor element having strong reducing atmosphere resistance and preparation method therefor19 Sep 2024US 2024/0312678 A1Jiangsu New Linzhi Electronic Technology Co., Ltd.
- Preparation method for copper plate-covered silicon nitride ceramic substrate29 Feb 2024US 2024/0067577 A1Shanghai Institute of Ceramics, Chinese Academy of Sciences
Most cited
By later US patents
- Brazing of diamond film to tungsten carbide105US 5,738,698 ASaint-Gobain/Norton Industrial Ceramics Corporation · 1998
- Thermostructural composite structure with a compositional gradient, its manufacturing process98US 7,560,139 B2Snecma Propulsion Solide · 2009
- Bonds between metal and a non-metallic substrate69US 3,993,411 AGeneral Electric Company · 1976
- Electrostatic chuck bonded to base with a bond layer and method58US 6,490,146 B2APPLIED Materials.Inc. · 2002
- Method of producing a high temperature, high strength bond between a ceramic shape and metal shape41US 4,875,616 AAmerica Matrix, Inc. · 1989