Electrostatic chuck bonded to base with a bond layer and method

A method of fabricating an electrostatic chuck for holding a substrate, the method comprising the steps of:

• (a) forming an electrostatic member comprising a dielectric covering an electrode that is chargeable to electrostatically hold the substrate;
• (b) forming a base comprising a porous ceramic having a pore volume of from about 20 to about 80 volume %, and a heater capable of raising the temperature of a substrate held on the electrostatic member by at least about 100° C.;
• and
• (c) bonding the base to the electrostatic member by a bond layer comprising a metal that is infiltrated into the porous ceramic.

A method of fabricating an electrostatic chuck for holding a substrate, the method comprising the steps of:

• (a) forming an electrostatic member comprising a dielectric covering an electrode that is chargeable to electrostatically hold the substrate;
• (b) forming a base comprising a composite of a ceramic and metal, the composite comprising a coefficient of thermal expansion within about ±30% of a coefficient of thermal expansion of the electrostatic member;
• and
• (c) bonding the base to the electrostatic member by a bond layer.