C04B 2237/561
Constraining layers not covering the whole surface of the layers to be
Official title: Constraining layers not covering the whole surface of the layers to be sintered, e.g. constraining layers with holes
C04B2237/561 (Constraining layers not covering the whole surface of the layers to be) appears on 14 US grants and 19 published applications in this corpus.
Search patents in C04B- Granted patents
- 14
- Published applications
- 19
- Assignees
- 15
- Inventors
- 39
- Latest grant
- 26 Mar 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 1 | 2 |
| 2003 | 2 | 4 |
| 2004 | 2 | 2 |
| 2005 | 0 | 1 |
| 2006 | 1 | 0 |
| 2007 | 0 | 1 |
| 2008 | 1 | 1 |
| 2009 | 0 | 0 |
| 2010 | 1 | 1 |
| 2011 | 1 | 2 |
| 2012 | 1 | 0 |
| 2013 | 0 | 0 |
| 2014 | 1 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 1 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 1 | 1 |
| 2021 | 0 | 1 |
| 2022 | 0 | 1 |
| 2023 | 1 | 0 |
| 2024 | 1 | 0 |
| 2025 | 0 | 0 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Sensor element, gas sensor, and method for manufacturing sensor element26 Mar 2024US 11,940,405 B2Niterra Co., Ltd.
- Process and formulation to join ceramic forms while maintaining structural and physical characteristics across the bond surface8 Aug 2023US 11,718,731 B2The Boeing Company
- Process and formulation to join ceramic forms while maintaining structural and physical characteristics across the bond surface7 Jul 2020US 10,703,879 B2The Boeing Company
- Method for the manufacture of double-sided metalized ceramic substrates4 Nov 2014US 8,876,996 B2IXYS Semiconductor GmbH
- Process for producing ceramic substrate28 Feb 2012US 8,123,882 B2Murata Manufacturing Co., Ltd.
- Ceramic window assembly23 Apr 2026US 2026/0109652 A1Element Six Technologies Limited
- Method for Manufacturing Silicon Nitride Substrate24 Nov 2022US 2022/0371963 A1Oci Company Ltd.
- Sensor element, gas sensor, and method for manufacturing sensor element18 Mar 2021US 2021/0080423 A1Ngk Spark Plug Co., Ltd.
- Process and Formulation to Join Ceramic Forms While Maintaining Structural and Physical Characteristics Across The Bond Surface16 Jul 2020US 2020/0224003 A1The Boeing Company
- Process and Formulation to Join Ceramic Forms While Maintaining Structural and Physical Characteristics Across The Bond Surface30 Jun 2016US 2016/0185935 A1The Boeing Company
Most cited
By later US patents
- Ultra-thin flexible expanded graphite heating element16US 6,667,100 B2Egc Enterprises, Inc. · 2003
- Laminated structure and method of forming same9US 7,045,239 B2Ceramic Fuel Cells Limited · 2006
- Greensheet carriers and processing thereof8US 6,607,620 B2International Business Machines Corporation · 2003
- Apparatus and method for laser fusion bonding6US 6,373,025 B1Nippon Sheet Glass Co., Ltd. · 2002
- Method for forming non-oxide selectively porous materials4US 7,332,116 B2The Boeing Company · 2008