Method for the manufacture of double-sided metalized ceramic substrates
AssigneeIXYS Semiconductor GmbH
InventorsWerner Weidenauer, Thomas Spann, Heiko Knoll
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Abstract
The invention relates to a method for the manufacture of double-sided metallized ceramic substrates according to the direct-bonding process. The method enables a ceramic substrate to be bonded to a metal plate or foil on the upper side and the underside in only one process sequence. The composite to be bonded is located on a specially designed carrier structured on the upper side with a plurality of contact points. After the bonding process the composite of metal plates and ceramic substrate can be detached from the carrier free of any residue.
Claims23
A method for the manufacture of double-sided metalized ceramic substrates according to a direct-bonding process comprising:
- placing an arrangement of a first metal plate, a second metal plate, and a ceramic substrate arranged between the first and second metal plates on a carrier without a separation layer between the arrangement and the carrier;
- and
- bonding the arrangement of the first and second metal plates and the ceramic substrate to form a double-sided metalized ceramic substrate by heating, wherein the carrier is structured on the upper side, which faces towards the arrangement of the first and second metal plate and the ceramic substrate, by a formation of a plurality of projecting assemblages which taper in a direction of the arrangement of the first and second metal plates and the ceramic substrate.
A method comprising:
- (a) forming an arrangement of a first metal plate, a second metal plate and a ceramic substrate, wherein the ceramic substrate is in between the first metal plate and the second metal plate;
- (b) placing the arrangement onto an upper surface of a carrier such that the arrangement is in contact with the upper surface of the carrier, wherein the upper surface of the carrier forms a plurality of projecting assemblages that extends in a direction towards the arrangement, and wherein the plurality of projecting assemblages taper in the direction;
- and
- (c) heating the arrangement of the first and second metal plates and the ceramic substrate to form a double-sided metalized ceramic substrate.
A method comprising:
- (a) mounting a package having a first metal plate, a second metal plate and a ceramic substrate onto a carrier, wherein the first metal plate is disposed on an upper surface of the ceramic substrate, wherein the second metal plate is disposed on a lower surface of the ceramic substrate, wherein an upper surface of the carrier forms a plurality of projecting assemblages, wherein the second metal plate is disposed directly on the plurality of projecting assemblages, and wherein each of the plurality of projecting assemblages tapers in a direction extending towards the second metal plate;
- and
- (b) performing a bonding process to form a double-sided metalized ceramic substrate from the package disposed on the carrier in (a).
Dependencies are inferred from the claim text.