Greensheet carriers and processing thereof

A method of processing greensheets for use as microelectronic substrates comprising:

• providing a greensheet having a width, a length and a thickness;
• bonding to the greensheet, entirely within the greensheet width and length, a frame having a thickness less than the greensheet thickness and adapted to constrain movement of the greensheet within the frame, the frame having a plurality of members subdividing the greensheet into a plurality of areas, each area being completely surrounded by frame members;
• and
• processing the greensheet and bonded frame;
• and
• removing the frame from the processed greensheet.

A method of processing greensheets for use as microelectronic substrates comprising:

• providing a greensheet having at least one active area;
• bonding to the greensheet a frame that completely surrounds the active area, the frame adapted to constrain movement of the at least one active area within the frame, at least a portion of an edge of the greensheet extending outside of the frame;
• processing the greensheet and bonded frame;
• and
• removing the frame from the processed greensheet.

A method of processing greensheets for use as microelectronic substrates comprising:

• providing a plurality of greensheets, each greensheet having at least one active area;
• processing the greensheets;
• stacking the greensheets while interleaving between desired pairs of greensheets at least one frame that completely surrounds the active area, the frame adapted to constrain movement of the at least one active area within the frame;
• laminating the stacked greensheets and at least one frame to form a processed laminate;
• and
• removing the at least one frame from the processed laminate.

A method of processing greensheets for use as microelectronic substrates comprising:

• providing a greensheet having a width, a length and a thickness;
• bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame;
• processing the greensheet and bonded frame by i) punching vias in the greensheet, ii) patterning the greensheet by applying conductive paste to the vias and a surface of the greensheet, and iii) stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets;
• and
• removing the frame from the processed greensheet.

A method of processing greensheets for use as microelectronic substrates comprising:

• providing a greensheet having a width, a length and a thickness;
• bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, the frame having a thickness less than that of the greensheet;
• processing the greensheet and bonded frame;
• and
• removing the frame from the processed greensheet.

A method of processing greensheets for use as microelectronic substrates comprising:

• providing a greensheet having a width, a length and a thickness;
• bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame;
• processing the greensheet and bonded frame, including stacking the greensheet and bonded frame with at least one other greensheet and bonded frame, and laminating the greensheets;
• and
• removing the frames from the processed greensheets.

A method of processing greensheets for use as microelectronic substrates comprising:

• providing a greensheet having a width, a length and a thickness, the greensheet further having a locator hole through the thickness thereof;
• bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, the frame having an opening therein corresponding to and protecting the greensheet locator hole;
• processing the greensheet and bonded frame;
• and
• removing the frame from the processed greensheet.