C04B 2237/525
By heating
Official title: by heating
C04B2237/525 (By heating) appears on 100 US grants and 60 published applications in this corpus.
Search patents in C04B- Granted patents
- 100
- Published applications
- 60
- Assignees
- 87
- Inventors
- 276
- Latest grant
- 12 Aug 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 4 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 1 | 0 |
| 1982 | 2 | 0 |
| 1983 | 3 | 0 |
| 1984 | 2 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 4 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 2 | 0 |
| 1992 | 5 | 0 |
| 1993 | 1 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 5 | 0 |
| 2000 | 3 | 0 |
| 2001 | 4 | 3 |
| 2002 | 3 | 7 |
| 2003 | 7 | 5 |
| 2004 | 5 | 1 |
| 2005 | 2 | 5 |
| 2006 | 1 | 3 |
| 2007 | 0 | 1 |
| 2008 | 3 | 2 |
| 2009 | 1 | 0 |
| 2010 | 0 | 3 |
| 2011 | 0 | 1 |
| 2012 | 0 | 3 |
| 2013 | 5 | 3 |
| 2014 | 1 | 0 |
| 2015 | 1 | 1 |
| 2016 | 0 | 1 |
| 2017 | 0 | 1 |
| 2018 | 0 | 0 |
| 2019 | 0 | 3 |
| 2020 | 3 | 5 |
| 2021 | 2 | 2 |
| 2022 | 1 | 4 |
| 2023 | 2 | 2 |
| 2024 | 6 | 3 |
| 2025 | 3 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Pure copper plate12 Aug 2025US 12,385,110 B2Mitsubishi Materials Corporation
- Bonding method for copper-copper metal with hydrazine hydrate3 Jun 2025US 12,322,724 B2Anhui University
- Ceramic-cladded copper plate and method for manufacturing ceramic-cladded copper plate22 Apr 2025US 12,284,766 B2BYD Company Limited
- Metal/ceramic bonding substrate and method for producing same19 Nov 2024US 12,145,352 B2Dowa Metaltech Co., Ltd.
- Copper/ceramic joined body and insulating circuit substrate22 Oct 2024US 12,125,765 B2Mitsubishi Materials Corporation
- Corrosion resistant power electronic modules30 Jul 2026US 2026/0223709 A1Rockwell Automation Technologies, Inc.
- Ceramic sheet and method of producing same31 Oct 2024US 2024/0360046 A1Zeon Corporation
- Bonding method for copper-copper metal4 Jul 2024US 2024/0222314 A1Anhui University
- Zirconia layered body27 Jun 2024US 2024/0208869 A1Tosoh Corporation
- Ceramic-cladded copper plate and method for manufacturing ceramic-cladded copper plate24 Aug 2023US 2023/0269879 A1BYD Company Limited
Most cited
By later US patents
- Fabrication of supported polycrystalline abrasive compacts158US 4,944,772 AGeneral Electric Company · 1990
- Living hard tissue replacement, its preparation127US 5,125,971 ATDK Corporation · 1992
- Graded metal-to-ceramic structure for high temperature abradable seal applications and a method of producing said77US 3,975,165 AUnion Carbide Corporation · 1976
- Polycrystalline diamond body/silicon carbide substrate composite67US 4,241,135 AGeneral Electric Company · 1980
- Method for making a ceramic multilayer structure having internal copper conductors56US 4,766,027 AE. I. Du Pont de Nemours and Company · 1988