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US 12,385,110 B2Granted
Pure copper plate
AssigneeMitsubishi Materials Corporation
InventorsYuki Ito, Hiroyuki Mori, Hiroyuki Matsukawa, Norihisa Iida, Motohiro Hitaka
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Abstract
This pure copper plate includes Cu having a purity of 99.96 mass % or higher, with a remainder of unavoidable impurities, wherein an amount of P is 2 mass ppm or less, and a total amount of Pb, Se, and Te is 10 mass ppm or less. The amount of S may be in a range of 2 mass ppm or more and 20 mass ppm or less.
Claims5
A pure copper plate comprising:
- Cu having a purity of 99.96 mass % or higher;
- and
- a remainder being unavoidable impurities, wherein
- an amount of P is 2 mass ppm or less,
- a total amount of Pb, Se, and Te is 10 mass ppm or less,
- an amount of S is in a range of 2 mass ppm or more and 20 mass ppm or less,
- a grain size of crystal grains in a rolled surface is in a range of 46 μm or more and 300 μm or less,
- an aspect ratio of crystal grains in a rolled surface is 1.1 or more and 2 or less, and
- a tensile strength of the pure copper plate is 243 MPa or more and 500 MPa or lower.
6 more elements
Dependencies are inferred from the claim text.