Copper/ceramic joined body and insulating circuit substrate
AssigneeMitsubishi Materials Corporation
InventorNobuyuki Terasaki
Life of this patent
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Abstract
A copper/ceramic bonded body is provided, including: a copper member made of copper or a copper alloy; and a ceramic member, the copper member and the ceramic member being bonded to each other, in which a total concentration of Al, Si, Zn, and Mn is 3 atom % or less when concentration measurement is performed by an energy dispersive X-ray analysis method at a position 1000 nm away from a bonded interface between the copper member and the ceramic member to a copper member side, assuming that a total value of Cu, Mg, Ti, Zr, Nb, Hf, Al, Si, Zn, and Mn is 100 atom %.
Claims8
A copper/ceramic bonded body, the copper and the ceramic bonded through a bonding material which contains Mg alone or a combination of Mg and an active metal, comprising:
- a copper member made of copper or a copper alloy;
- and
- a ceramic member containing Al or Si, the copper member and the ceramic member being bonded to each other,
- wherein a total concentration of Al, Si, Zn, and Mn is 3 atom % or less when concentration measurement is performed by an energy dispersive X-ray analysis method at a position 1000 nm away from a bonded interface between the copper member and the ceramic member to a copper member side, assuming that a total value of Cu, Mg, Ti, Zr, Nb, Hf, Al, Si, Zn, and Mn is 100 atom %,
- the bonding material is distributed in the copper member and the ceramic member,
- the active metal is one or more selected from Ti, Zr, Hf, and Nb, and
- the ceramic member is made of AlN, Al2O3, or Si3N4.
An insulating circuit substrate, comprising:
- a copper sheet made of copper or a copper alloy;
- and
- a ceramic substrate containing Al or Si, the copper sheet being bonded to a surface of the ceramic substrate through a bonding material which contains Mg alone, or a combination of Mg and an active metal,
- wherein a total concentration of Al, Si, Zn, and Mn is 3 atom % or less when concentration measurement is performed by an energy dispersive X-ray analysis method at a position 1000 nm away from a bonded interface between the copper sheet and the ceramic substrate to the copper sheet side, assuming that a total value of Cu, Mg, Ti, Zr, Nb, Hf, Al, Si, Zn, and Mn is 100 atom %,
- the bonding material is distributed in the copper sheet and the ceramic substrate,
- the ceramic substrate is made of AlN, Al2O3, or Si3N4, and
- the active metal is one or more selected from Ti, Zr, Hf, and Nb.
Dependencies are inferred from the claim text.