C03C 8/245
Containing more than 50% lead oxide, by weight
Official title: {containing more than 50% lead oxide, by weight}
C03C8/245 (Containing more than 50% lead oxide, by weight) appears on 110 US grants and 20 published applications in this corpus.
Search patents in C03C- Granted patents
- 110
- Published applications
- 20
- Assignees
- 40
- Inventors
- 182
- Latest grant
- 19 Oct 2021
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 7 | 0 |
| 1978 | 7 | 0 |
| 1979 | 1 | 0 |
| 1980 | 4 | 0 |
| 1981 | 4 | 0 |
| 1982 | 2 | 0 |
| 1983 | 4 | 0 |
| 1984 | 2 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 4 | 0 |
| 1988 | 5 | 0 |
| 1989 | 5 | 0 |
| 1990 | 5 | 0 |
| 1991 | 3 | 0 |
| 1992 | 3 | 0 |
| 1993 | 3 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 3 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 0 |
| 2002 | 3 | 1 |
| 2003 | 5 | 2 |
| 2004 | 2 | 3 |
| 2005 | 1 | 2 |
| 2006 | 3 | 1 |
| 2007 | 0 | 3 |
| 2008 | 1 | 0 |
| 2009 | 1 | 1 |
| 2010 | 1 | 2 |
| 2011 | 3 | 2 |
| 2012 | 1 | 0 |
| 2013 | 0 | 1 |
| 2014 | 1 | 0 |
| 2015 | 1 | 0 |
| 2016 | 0 | 1 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 1 | 1 |
| 2020 | 0 | 0 |
| 2021 | 1 | 0 |
By publication year. Applications have been published since 2001.
Recent patents
- Method and device for encapsulating components19 Oct 2021US 11,152,590 B2
- Heat-insulating member, low-melting glass composition, and sealing material paste23 Jul 2019US 10,358,379 B2Hitachi Chemical Company, Ltd.
- Method for sealing a liquid within a glass package and the resulting glass package20 Oct 2015US 9,165,719 B2Corning Incorporated
- Hot-melt sealing glass compositions and devices using the same22 Jul 2014US 8,786,034 B2Ferro Corporation
- Hot-melt sealing glass compositions and methods of making and using the same13 Nov 2012US 8,307,674 B2Ferro Corporation
- Method and device for encapsulating components23 May 2019US 2019/0157611 A1
- Heat-insulating member, low-melting glass composition, and sealing material paste13 Oct 2016US 2016/0297706 A1Hitachi Chemical Company, Ltd.
- Hot-Melt Sealing Glass Compositions And Devices Using The Same14 Mar 2013US 2013/0062712 A1Ferro Corporation
- Hot-Melt Sealing Glass Compositions And Methods Of Making And Using The Same14 Jul 2011US 2011/0169108 A1Ferro Corporation
- Method for sealing a liquid within a glass package and the resulting glass package9 Jun 2011US 2011/0135857 A1Corning Incorporated
Most cited
By later US patents
- Glass package that is hermetically sealed with a frit and method of fabrication185US 6,998,776 B2Corning Incorporated · 2006
- Glass package that is hermetically sealed with a frit and method of fabrication77US 7,407,423 B2Corning Incorporated · 2008
- Low melting glass composition71US 4,743,302 AVLSI Packaging Materials, Inc. · 1988
- Glass package that is hermetically sealed with a frit and method of fabrication62US 7,602,121 B2Corning Incorporated · 2009
- Liquid crystal cells50US 3,995,941 AAsahi Glass Company, Limited · 1976