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AssigneeFerro Corporation
InventorsRobert D. Gardner, Keith M. Mason, Srinivasan Sridharan, Aziz S. Shaikh
Estimating the term…
Hot-melt sealing glass compositions that include one or more glass frits dispersed in a polymeric binder system. The polymeric binder system is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C., thereby forming a flowable liquid dispersion that can be applied to a substrate (e.g., a cap wafer and/or a device wafer of a MEMS device) by screen printing. Hot-melt sealing glass compositions according to the invention rapidly re-solidify and adhere to the substrate after being deposited by screen printing. Thus, they do not tend to spread out as much as conventional solvent-based glass frit bonding pastes after screen printing. And, because hot-melt sealing glass compositions according to the invention are not solvent-based systems, they do not need to be force dried after deposition.
An apparatus including a MEMS device, wherein the MEMS device is hermetically sealed in a cavity defined by a cap wafer, a device wafer, and a hermetic glass seal, the hermetic glass seal being formed from a hot-melt sealing glass composition comprising:
An apparatus including a MEMS device, wherein the MEMS device is hermetically sealed in a cavity defined by a cap wafer, a device wafer, and a hermetic glass seal, the hermetic glass seal being formed from a hot-melt sealing glass composition comprising:
Dependencies are inferred from the claim text.