Method and device for encapsulating components
AssigneesLeander Gross, Mascha Gross
InventorHarald Gross
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Abstract
A method and a device for hermetically encapsulating components using at least one gas discharge lamp, an inorganic material that is transparent for light and a light-absorbing inorganic medium, are provided. With a suitable selection, inorganic materials or inorganic media guarantee a very low level of permeability for oxygen, water vapor and reactive gases in contrast to organic materials or organic media. The encapsulation occurs in a time period of less than one second. In addition, the average temperature of the component only increases slightly, such that even components with temperature-sensitive regions can be encapsulated.
Claims12
A method for encapsulating a component using an inorganic light-transparent material and using an inorganic light-absorbing means, comprising:
- placing a mask over the component between the light-transparent material and at least one gas discharge lamp;
- using the mask to limit light incidence to regions of the component to be bonded with the inorganic light-absorbing means;
- emitting light from the at least one gas discharge lamp over the entire mask and through openings of the mask positioned over the regions of the component;
- and
- heating the light-absorbing means for a duration of less than one second with the aid of the at least one gas discharge lamp for hermetic bonding of the component to the light-transparent material.
Dependencies are inferred from the claim text.