Low melting glass composition
AssigneeVLSI Packaging Materials, Inc.
InventorsMaurice E. Dumesnil, Leo Finkelstein
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AssigneeVLSI Packaging Materials, Inc.
InventorsMaurice E. Dumesnil, Leo Finkelstein
Estimating the term…
Fluid, stable glasses that are useful for low temperature sealing applications are made by adding jointly bismuth oxide, zinc oxide, and phosphorus pentoxide to the lead oxide-vanadium oxide binary. The phosphorous pentoxide may be replaced partially or entirely with niobium pentoxide and/or tantalum pentoxide. Additives and fillers may be incorporated into the glass composition to enhance the fluidity or adhesive characteristics of the glass, alter its coefficient of linear thermal expansion or make it suitable for die attach application. Group V metal oxides, particularly niobium pentoxide, are preferred fillers for altering the coefficient of linear thermal expansion. Similarly these Group V metal oxides may also be added as particulate fillers to lead borate, lead borosilicate and zinc borate glasses. Silver metal is a preferred filler for making die attach compositions.
A low melting glass composition comprising in weight percent calculated on an oxide basis:
A low melting glass composition comprising in weight percent calculated on an oxide basis
A low melting glass composition consisting essentially of in weight percent calculated on an oxide basis:
Dependencies are inferred from the claim text.