Glass package that is hermetically sealed with a frit and method of fabrication

A glass package comprising:

• a first glass substrate with a first coefficient of thermal expansion (CTE);
• a second glass substrate with a second CTE;
• a frit made from a lead free glass comprising one or more transition metals and a CTE lowering filler, the frit having a third CTE less than the first or second CTE and the filler having a mean particle size less than about 20 μm;
• an organic layer positioned between the first and second glass substrates;
• and
• wherein the frit was heated by an irradiation source to melt the frit and form a hermetic seal between the first and second glass plates.

An organic light emitting diode device comprising:

• a first and second glass substrate suitable for use in an organic light emitting diode device;
• a lead-free frit forming a hermetic seal between the first and second substrates and expansion matched thereto;
• an organic light emitting diode disposed between the first and second glass substrates;
• and
• an adhesive within a gap located between outer edges of the first and second glass substrates, wherein said gap is caused by the presence of the hermetic seal.

A hermetically sealed glass package comprising:

• a first glass plate;
• a second glass plate;
• a frit made from glass doped with at least one transition metal and a coefficient of thermal expansion (CTE) lowering filler positioned between the first glass plate and the second glass plate, the filler comprising no more than about 30% of the fit;
• a temperature sensitive material positioned between the first and second glass plates;
• and
• wherein the fit was heated with a laser in a manner that caused the frit to soften and form a hermetic seal between the first and second glass plates, thereby hermetically sealing the temperature sensitive material between the first and second glass plates, and wherein a temperature of the temperature sensitive material did not exceed about 100° C. during the heating.