C03B 33/02
Cutting or splitting sheet glass or ribbons
Official title: Cutting or splitting sheet glass {or ribbons}; Apparatus or machines therefor (C03B33/09 takes precedence; glass-cutting tools C03B33/10)
C03B33/02 (Cutting or splitting sheet glass or ribbons) appears on 956 US grants and 1,205 published applications in this corpus.
Search patents in C03B- Granted patents
- 956
- Published applications
- 1,205
- Assignees
- 332
- Inventors
- 2,039
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 9 | 0 |
| 1977 | 9 | 0 |
| 1978 | 10 | 0 |
| 1979 | 8 | 0 |
| 1980 | 8 | 0 |
| 1981 | 11 | 0 |
| 1982 | 4 | 0 |
| 1983 | 4 | 0 |
| 1984 | 10 | 0 |
| 1985 | 9 | 0 |
| 1986 | 4 | 0 |
| 1987 | 8 | 0 |
| 1988 | 3 | 0 |
| 1989 | 4 | 0 |
| 1990 | 7 | 0 |
| 1991 | 13 | 0 |
| 1992 | 8 | 0 |
| 1993 | 3 | 0 |
| 1994 | 6 | 0 |
| 1995 | 9 | 0 |
| 1996 | 3 | 0 |
| 1997 | 1 | 0 |
| 1998 | 7 | 0 |
| 1999 | 9 | 0 |
| 2000 | 1 | 0 |
| 2001 | 6 | 8 |
| 2002 | 14 | 14 |
| 2003 | 12 | 20 |
| 2004 | 12 | 32 |
| 2005 | 7 | 25 |
| 2006 | 13 | 36 |
| 2007 | 11 | 29 |
| 2008 | 10 | 26 |
| 2009 | 15 | 43 |
| 2010 | 21 | 48 |
| 2011 | 26 | 42 |
| 2012 | 34 | 44 |
| 2013 | 34 | 55 |
| 2014 | 52 | 59 |
| 2015 | 39 | 88 |
| 2016 | 46 | 76 |
| 2017 | 54 | 65 |
| 2018 | 40 | 81 |
| 2019 | 55 | 79 |
| 2020 | 64 | 53 |
| 2021 | 42 | 65 |
| 2022 | 28 | 60 |
| 2023 | 34 | 48 |
| 2024 | 49 | 52 |
| 2025 | 43 | 27 |
| 2026 | 27 | 30 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- C03B 33/023The sheet or ribbon being in a horizontal position520
- C03B 33/0222Scoring using a focussed radiation beam348
- C03B 33/04Cutting or splitting in curves, especially for making spectacle lenses243
- C03B 33/0215The ribbon being in a substantially vertical plane73
- C03B 33/0207The sheet being in a substantially vertical plane24
Recent patents
- Laser dicing glass wafers using advanced laser sources8 Sep 2026US 12,729,148 B2APPLIED Materials.Inc.
- Material processing by turbo burst ultrafast laser pulse11 Aug 2026US 12,703,043 B2APPLIED Materials.Inc.
- Sound-assisted crack propagation for semiconductor wafering4 Aug 2026US 12,697,753 B2Arizona Board of Regents on behalf of Arizona State University
- Method and device for laser processing of transparent materials28 Jul 2026US 12,691,531 B2Uab Altechna R&D
- Method for cutting a laminated glazing by means of a laser source21 Jul 2026US 12,686,628 B2Saint-Gobain Sekurit France
- Method for cutting a laminated glazing by means of a laser source1 Oct 2026US 2026/0296946 A1Saint-Gobain Sekurit France
- Glass plate manufacturing method and manufacturing apparatus17 Sep 2026US 2026/0274734 A1Nippon Electric Glass Co., Ltd.
- Method and device for machining workpieces3 Sep 2026US 2026/0257958 A1Schott AG
- Unit and method for detecting the position of a sheet and apparatus for working sheets comprising said position detection unit3 Sep 2026US 2026/0257959 A1
- Apparatus for manufacturing cover window, method for manufacturing cover window, and electronic device including cover window27 Aug 2026US 2026/0250177 A1Samsung Display Co., Ltd.
Most cited
By later US patents
- Laser processing method and laser processing apparatus293US 6,992,026 B2Hamamatsu Photonics K.K. · 2006
- Crack and scratch resistant glass and enclosures made therefrom172US 8,586,492 B2Corning Incorporated · 2013
- Method for laser-scribing brittle substrates and apparatus therefor139US 6,787,732 B1Seagate Technology LLC · 2004
- Combined laser-scribing and laser-breaking for shaping of brittle substrates122US 6,744,009 B1Seagate Technology LLC · 2004
- Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the object117US 7,396,742 B2Hamamatsu Photonics K.K. · 2008