Laser dicing glass wafers using advanced laser sources

A method comprising:

• exposing a substrate to a first plurality of laser pulses at a first location along a dicing path of a respective waveguide combiner, the substrate having a plurality of waveguides, each laser pulse within the first plurality of laser pulses forming a respective void within a first column at the first location to form a plurality of voids;
• and
• exposing the substrate to a second plurality of laser pulses at a second location along the dicing path of the respective waveguide combiner, each laser pulse within the second plurality of laser pulses forming the respective void within a second column at the second location to form the plurality of voids, the first column and the second column are spaced by a pitch between a center of the first column and the second column along the dicing path.

A non-transitory computer-readable medium storing instructions that, when executed by a processor, cause a computer system to perform operations of:

• exposing a substrate to a first plurality of laser pulses at a first location along a dicing path of a respective waveguide combiner, the substrate having a plurality of waveguides, each laser pulse within the first plurality of laser pulses forming a respective void within a first column at the first location to form a plurality of voids;
• and
• exposing the substrate to a second plurality of laser pulses at a second location along the dicing path of the respective waveguide combiner, each laser pulse within the second plurality of laser pulses forming the respective void within a second column at the second location to form the plurality of voids, the first column and the second column are spaced by a pitch between a center of the first column and the second column along the dicing path.