Combined laser-scribing and laser-breaking for shaping of brittle substrates
AssigneeSeagate Technology LLC
InventorsJialuo Jack Xuan, Chung-Yuang Shih
Life of this patent
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Abstract
A method of segmenting a sheet of a brittle material, comprising sequential steps of: subjecting the sheet to a first laser-based process to form a laser-scribing line extending from a surface of the sheet to a first depth below the surface; subjecting the sheet to a second laser-based process to form a laser-breaking line extending from the laser-scribing line at the first depth below the surface to a second, greater depth below the surface; and segmenting the sheet along the thus-formed combined laser scribing + laser-breaking line.
Claims19
A method of segmenting a sheet of a brittle material, comprising sequential steps of:
- subjecting said sheet to a first laser-based process to form therein a laser-scribing line extending from a first surface of said sheet to a first depth below said first surface;
- subjecting said sheet to a second laser-based process to form therein a laser-breaking line extending from said laser-scribing line at said first depth below said first surface to a second, greater depth below said first surface;
- and
- segmenting said sheet along the thus-formed combined laser scribing + laser-breaking line.
An apparatus for performing combined laser-scribing and laser-breaking of a sheet of a brittle material, comprising:
- (a) at least one combined laser-scribing/laser-breaking assembly including, in spaced-apart relation and in the recited order
- (i) a first source of laser radiation adapted for irradiating selected portions of a first surface of said sheet of brittle material with a first wavelength laser beam for forming a laser-scribing line therein extending from said first surface to a first depth below said first surface;
- (ii) a source of fluid coolant adapted for cooling said selected portions of said first surface of said sheet subsequent to said irradiation by said first source of laser radiation;
- and
- (iii) a second source of laser radiation adapted for irradiating said selected portions of said first surface of said sheet with a second wavelength laser beam for forming therein a laser-breaking line extending from said first depth below said first surface to a second, greater depth below said first surface to thereby form a combined laser-scribing + laser-breaking line;
- and
- (b) means for effecting relative movement between said first surface of said sheet and said at least one combined laser-scribing/laser-breaking assembly to form at least one said combined laser-scribing + laser-breaking line extending along a predetermined path.
Dependencies are inferred from the claim text.