B41C 1/08
Forme preparation: by embossing
Official title: by embossing, e.g. with a typewriter (typewriters adapted therefor B41J3/38)
B41C1/08 (Forme preparation: by embossing) appears on 6 US grants and 9 published applications in this corpus.
Search patents in B41C- Granted patents
- 6
- Published applications
- 9
- Assignees
- 9
- Inventors
- 19
- Latest grant
- 31 Dec 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 1 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 0 |
| 2010 | 0 | 0 |
| 2011 | 1 | 1 |
| 2012 | 0 | 0 |
| 2013 | 0 | 1 |
| 2014 | 0 | 2 |
| 2015 | 1 | 1 |
| 2016 | 0 | 0 |
| 2017 | 0 | 1 |
| 2018 | 0 | 0 |
| 2019 | 1 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 1 |
| 2023 | 0 | 0 |
| 2024 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Wiring formation method and transfer mold manufacturing method31 Dec 2024US 12,181,796 B2CONNECTEC JAPAN Corporation
- Silicone rubber material for soft lithography5 Mar 2019US 10,220,563 B2Koninklijke Philips N. V.
- Silicone rubber material for soft lithography26 May 2015US 9,038,536 B2Koninklijke Philips N. V.
- Photo definable polyimide film used as an embossing surface12 Apr 2011US 7,923,173 B1Illinois Tool Works Inc.
- Printing form and process for producing the printing form24 Aug 2004US 6,779,444 B2Heidelberger Druckmaschinen AG
- Wiring formation method and transfer mold manufacturing method25 Jan 2024US 2024/0032205 A1CONNECTEC JAPAN Corporation
- Flexographic printing form precursor and a method for making the precursor20 Jan 2022US 2022/0016879 A1Dupont Electronics, Inc.
- Plate for creating holograms and method for manufacturing the plate19 Jan 2017US 2017/0017201 A1Heidelberger Druckmaschinen AG
- Silicone rubber material for soft lithography27 Aug 2015US 2015/0239171 A1Koninklijke Philips N. V.
- Foil stamping method and corresponding device16 Oct 2014US 2014/0305577 A1
Most cited
By later US patents
- Printing form and process for producing the printing form21US 6,779,444 B2Heidelberger Druckmaschinen AG · 2004
- Tipper for embossed cards and removable cassette for use therewith10US 4,343,837 ADBS, Inc. · 1982
- Photo definable polyimide film used as an embossing surface2US 7,923,173 B1Illinois Tool Works Inc. · 2011
- Silicone rubber material for soft lithography1US 9,038,536 B2Koninklijke Philips N. V. · 2015