Wiring formation method and transfer mold manufacturing method

A wiring formation method in which recesses arranged in a prescribed pattern in a transfer mold are filled with an electroconductive member, the transfer mold filled with the electroconductive member is laid over a surface of a substrate having recesses and protrusions, the electroconductive member is transferred to the surface of the substrate, and a wiring part is formed on the surface of the substrate by using the electroconductive member, the wiring formation method being characterized by including a preparation step for preparing a soft transfer mold having a durometer A hardness of 40-70 as the transfer mold, and a pressure contact step for laying the transfer mold over the surface of the substrate, after which the transfer mold deforms in accordance with the recesses and protrusions, and pressure contact is carried out such that a surface of the transfer mold comes into close contact with the surface of the substrate.