B29L 2031/3425
Printed circuits
Official title: {Printed circuits}
B29L2031/3425 (Printed circuits) appears on 394 US grants and 334 published applications in this corpus.
Search patents in B29L- Granted patents
- 394
- Published applications
- 334
- Assignees
- 270
- Inventors
- 918
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 2 | 0 |
| 1984 | 2 | 0 |
| 1985 | 6 | 0 |
| 1986 | 5 | 0 |
| 1987 | 6 | 0 |
| 1988 | 8 | 0 |
| 1989 | 11 | 0 |
| 1990 | 15 | 0 |
| 1991 | 6 | 0 |
| 1992 | 13 | 0 |
| 1993 | 6 | 0 |
| 1994 | 14 | 0 |
| 1995 | 5 | 0 |
| 1996 | 9 | 0 |
| 1997 | 8 | 0 |
| 1998 | 7 | 0 |
| 1999 | 2 | 0 |
| 2000 | 3 | 0 |
| 2001 | 3 | 1 |
| 2002 | 5 | 4 |
| 2003 | 2 | 6 |
| 2004 | 4 | 9 |
| 2005 | 5 | 7 |
| 2006 | 4 | 4 |
| 2007 | 4 | 12 |
| 2008 | 3 | 5 |
| 2009 | 2 | 10 |
| 2010 | 5 | 8 |
| 2011 | 6 | 3 |
| 2012 | 5 | 6 |
| 2013 | 2 | 5 |
| 2014 | 4 | 5 |
| 2015 | 7 | 17 |
| 2016 | 6 | 22 |
| 2017 | 18 | 17 |
| 2018 | 16 | 34 |
| 2019 | 21 | 25 |
| 2020 | 20 | 27 |
| 2021 | 24 | 23 |
| 2022 | 18 | 26 |
| 2023 | 17 | 16 |
| 2024 | 26 | 28 |
| 2025 | 18 | 10 |
| 2026 | 16 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Robotic systems for additive manufacturing22 Sep 2026US 12,741,421 B2University of Louisville Research Foundation, Inc.
- Additive manufacturing on an application-specific substrate22 Sep 2026US 12,741,425 B2Intrepid Automation
- Pressure sensing system and seat cushion having the pressure sensing system25 Aug 2026US 12,715,392 B2Magna Seating Inc.
- Method for producing encapsulated structure and epoxy resin composition28 Jul 2026US 12,692,385 B2Sumitomo Bakelite Co., Ltd.
- Three-dimensional laminate shaping device14 Jul 2026US 12,679,039 B2Fuji Corporation
- Methods, systems, and apparatuses for manufacturing wearable ring devices1 Oct 2026US 2026/0295929 A1
- Molding method and molding system14 May 2026US 2026/0131510 A1The Japan Steel Works, Ltd.
- Additive manufacturing on an application-specific substrate19 Feb 2026US 2026/0048553 A1Intrepid Automation
- Resin molding device, and method for manufacturing resin molded article12 Feb 2026US 2026/0042243 A1Towa Corporation
- Securing board in in-mold electronics (ime) process25 Dec 2025US 2025/0387959 A1Covestro LLC
Most cited
By later US patents
- Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products216US 5,037,691 ACompositech, Inc. · 1991
- PCMCIA standard memory card frame89US 5,397,857 ADual Systems Corporation · 1995
- Simple enclosure for electronic components81US 6,111,760 AEricsson Inc. · 2000
- Manufacture of electrical circuits69US 5,003,693 AAllen-Bradley International Limited · 1991
- Printed circuit board with metallized grooves57US 5,451,722 A1995