Manufacture of electrical circuits
AssigneeAllen-Bradley International Limited
InventorsAnthony Atkinson, Richard Gray, Oscar L. Denes
Life of this patent
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Abstract
A method of providing an electrical circuit wherein a carrier, which is a film of insulating plastic material with a circuit pattern thereon is supported in a mould and a moulding material is applied by the application of heat and pressure to provide a substrate so that the circuit is embedded in or within a three-dimensional surface of the moulded substrate.
Claims20
A method of providing an electrical circuit in a three-dimensionally shaped surface of insulating plastics material, comprising the sequential or non-sequential steps of:
- (i) providing a carrier, which is a film of insulating plastics material, with a circuit pattern of electro-conductive or electro-resistive, heat-resistant synthetic resin applied to at least one face thereof;
- (ii) supporting a face of the carrier;
- (ii) forming the patterned carrier into a given three-dimensional shape;
- and
- (iv) moulding, by the application of heat and pressure, a substrate of insulating plastics material against the unsupported face of the carrier;
- so that the circuit is embedded in a surface of the moulded substrate forming the three-dimensional surface.
A method for moulding an electrical circuit package wherein a flexible support member is secured to a substrate comprising:
- placing an electrically conductive circuit trace material on one side of a thin flexible film material;
- positioning said flexible film material in a mould;
- and
- introducing a resinous plastic material into said mould in a manner to fuse with said flexible film material.
Dependencies are inferred from the claim text.