Resin molding device, and method for manufacturing resin molded article
AssigneeTowa Corporation
InventorsSatoshi NAKAO, Hayato YASUI
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AssigneeTowa Corporation
InventorsSatoshi NAKAO, Hayato YASUI
Estimating the term…
The present invention provides a resin molding apparatus that clamps a plurality of molding dies and that performs resin molding by, while synchronizing the closing of the plurality of molding dies, absorbing variations in the thickness of the object-to-be-molded in each molding die, and includes a raising-and-lowering linking mechanism that causes the raising and lowering of an intermediate plate to occur together with the raising and lowering of a movable platen, the raising-and-lowering linking mechanism comprising a pantograph mechanism that extends and contracts due to the raising and lowering of the movable platen, and a coupling mechanism that couples a cross link part of the pantograph mechanism and the intermediate plate, and the coupling mechanism has a connecting member connected to the cross link part, a coupling member that couples the connecting member to the intermediate plate, and an elastic member interposed between the connecting member and the coupling member.
A resin molding apparatus comprising:
Dependencies are inferred from the claim text.