B28D 5/029
With a plurality of cutting blades
Official title: {with a plurality of cutting blades}
B28D5/029 (With a plurality of cutting blades) appears on 90 US grants and 81 published applications in this corpus.
Search patents in B28D- Granted patents
- 90
- Published applications
- 81
- Assignees
- 42
- Inventors
- 163
- Latest grant
- 26 Nov 2024
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 5 | 0 |
| 2001 | 6 | 7 |
| 2002 | 13 | 10 |
| 2003 | 9 | 10 |
| 2004 | 5 | 5 |
| 2005 | 7 | 8 |
| 2006 | 4 | 6 |
| 2007 | 2 | 4 |
| 2008 | 3 | 0 |
| 2009 | 2 | 0 |
| 2010 | 0 | 2 |
| 2011 | 0 | 4 |
| 2012 | 1 | 4 |
| 2013 | 4 | 5 |
| 2014 | 2 | 1 |
| 2015 | 0 | 1 |
| 2016 | 3 | 2 |
| 2017 | 1 | 0 |
| 2018 | 0 | 3 |
| 2019 | 2 | 1 |
| 2020 | 2 | 3 |
| 2021 | 1 | 3 |
| 2022 | 3 | 0 |
| 2023 | 1 | 1 |
| 2024 | 1 | 0 |
| 2025 | 0 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Edge alignment method26 Nov 2024US 12,151,401 B2Disco Corporation
- Blade holding jig3 Oct 2023US 11,772,300 B2Disco Corporation
- Cutting apparatus, cutting blade replacement method, and board replacement method8 Nov 2022US 11,491,669 B2Disco Corporation
- Transfer jig and cutting blade changing method3 May 2022US 11,318,573 B2Disco Corporation
- Blade changer unit5 Apr 2022US 11,292,145 B2Disco Corporation
- Dicing device16 Jan 2025US 2025/0018605 A1Tokyo Seimitsu Co., Ltd.
- Machining apparatus9 Mar 2023US 2023/0074984 A1Towa Corporation
- Cutting apparatus, cutting blade replacement method, and board replacement method14 Oct 2021US 2021/0316468 A1Disco Corporation
- Blade holding jig14 Oct 2021US 2021/0316477 A1Disco Corporation
- Edge alignment method23 Sep 2021US 2021/0291404 A1Disco Corporation
Most cited
By later US patents
- Method for sawing wafers employing multiple indexing techniques for multiple die dimensions289US 6,578,458 B1Micron Technology, Inc. · 2003
- Dual laser cutting of wafers137US 6,562,698 B2Kulicke & Soffa Investments, Inc. · 2003
- Method for cutting semiconductor wafers106US 6,576,531 B2Micron Technology, Inc. · 2003
- Semiconductor wafer dicing machine82US 4,688,540 ADisco Abrasive Systems, Ltd. · 1987
- Method for singulating semiconductor wafers66US 6,420,245 B1Kulicke & Soffa Investments, Inc. · 2002