B24D 7/12
Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting
Official title: with apertures for inspecting the surface to be abraded
B24D7/12 (Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting) appears on 82 US grants and 41 published applications in this corpus.
Search patents in B24D- Granted patents
- 82
- Published applications
- 41
- Assignees
- 37
- Inventors
- 122
- Latest grant
- 11 Mar 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 4 | 0 |
| 2000 | 12 | 0 |
| 2001 | 9 | 1 |
| 2002 | 10 | 2 |
| 2003 | 8 | 8 |
| 2004 | 7 | 6 |
| 2005 | 6 | 3 |
| 2006 | 4 | 3 |
| 2007 | 3 | 1 |
| 2008 | 3 | 3 |
| 2009 | 0 | 1 |
| 2010 | 0 | 1 |
| 2011 | 1 | 2 |
| 2012 | 0 | 0 |
| 2013 | 2 | 0 |
| 2014 | 1 | 3 |
| 2015 | 1 | 1 |
| 2016 | 0 | 0 |
| 2017 | 2 | 1 |
| 2018 | 0 | 0 |
| 2019 | 1 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 0 |
| 2022 | 0 | 2 |
| 2023 | 0 | 2 |
| 2024 | 0 | 0 |
| 2025 | 1 | 1 |
By publication year. Applications have been published since 2001.
Recent patents
- Polishing pad and method of fabricating semiconductor device using the same11 Mar 2025US 12,246,408 B2SK enpulse Co., Ltd.
- Processing end point detection method, polishing method, and polishing apparatus19 Feb 2019US 10,207,390 B2Toshiba Memory Corporation
- Peak-based endpointing for chemical mechanical polishing24 Oct 2017US 9,799,578 B2APPLIED Materials.Inc.
- Peak-based endpointing for chemical mechanical polishing7 Feb 2017US 9,564,377 B2APPLIED Materials.Inc.
- Double-side polishing apparatus18 Aug 2015US 9,108,289 B2Shin-Etsu Handotai Co., Ltd.
- Polishing apparatus and polishing method9 Jan 2025US 2025/0010428 A1Ebara Corporation
- Polishing pad and method for manufacturing polishing pad28 Dec 2023US 2023/0415300 A1Fujibo Holdings, Inc.
- Endpoint window with controlled texture surface1 Jun 2023US 2023/0166380 A1CMC Materials, Inc.
- Endpoint window with controlled texture surface28 Jul 2022US 2022/0234167 A1CMC Materials, Inc.
- Polishing pad and method of fabricating semiconductor device using the same10 Mar 2022US 2022/0072678 A1SKC solmics Co., Ltd.
Most cited
By later US patents
- In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing472US 5,433,651 AInternational Business Machines Corporation · 1995
- Polishing method251US 5,609,511 AHitachi, Ltd. · 1997
- Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing180US 6,159,073 AAPPLIED Materials.Inc. · 2000
- Method and apparatus for endpoint detection for chemical mechanical polishing127US 6,106,662 ASpeedFam-IPEC Corporation · 2000
- Wafer polishing device with movable window117US 6,068,539 ALam Research Corporation · 2000