Endpoint window with controlled texture surface
AssigneeCMC Materials, Inc.
InventorsPaul Andre LEFEVRE, Dustin Miller, Gary Snider, Carlos Barros, Anthony Galto
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Abstract
A chemical mechanical polishing pad window having a controlled texture surface comprising repeated patterned features. The window results in an improved endpoint detection and in situ rate monitoring by providing consistent values of the ISRMmax-min characteristic over the lifetime of a CMP pad. Also provided is a chemical mechanical polishing pad with the inventive window.
Claims20
A window for a chemical mechanical planarization (CMP) pad, the window comprising a material transmissive to light, wherein a first surface of the window has a controlled texture surface comprising repeated patterned features.
A chemical mechanical planarization (CMP) pad comprising:
- a top surface which contacts a substrate being planarized during a CMP process using the CMP pad;
- a bottom surface opposite the top surface;
- and
- a window that allows light to pass between a top side of the CMP pad associated with the top surface and a bottom side of the CMP pad associated with the bottom surface, the window comprising a material transmissive to light, wherein a first surface of the window has repeated patterned features.
Dependencies are inferred from the claim text.