Wafer polishing device with movable window

In a linear chemical mechanical polisher of the type comprising:

• at least two rollers, a belt comprising a polishing surface, said belt mounted to extend between the rollers such that rotation of the rollers drives the belt, and a wafer carrier positioned adjacent the belt to press a wafer into contact with the belt intermediate the rollers, the improvement comprising:
• a window comprising a first surface and movably disposed within said belt to move between first and second positions, said first surface being closer to the polishing surface in the second position than in the first position, said window positioned to move intermittently into alignment with the wafer as the belt is driven by the rollers.

A chemical mechanical polishing element comprising:

• a rotating platen comprising a polishing surface;
• and
• a window comprising a first surface and movably disposed within said platen to move between first and second positions, said first surface being closer to said polishing surface in the second position than in the first position.

In a chemical mechanical polisher of the type comprising:

• a rotating platen comprising a polishing surface, means for moving the platen along a rotating polishing path, and a wafer carrier positioned adjacent the polishing element to press a wafer against the polishing surface during a polishing operation;
• the improvement comprising:
• a window comprising a first surface and movably disposed within said rotating platen to move between first and second positions, said first surface being closer to said polishing surface in the second position than in the first position, said window positioned to move intermittently into alignment with the wafer during the polishing operation.

A chemical mechanical polishing element comprising:

• an orbital platen comprising a polishing surface;
• and
• a window comprising a first surface and movably disposed within said platen to move between first position and second positions, said first surface being closer to said polishing surface in the second position than in the first position.

In a chemical mechanical polisher of the type comprising:

• an orbital platen comprising a polishing surface, means for moving the platen along an orbital polishing path, and a wafer carrier positioned adjacent the platen element to press a wafer against the polishing surface during a polishing operation;
• the improvement comprising:
• a window comprising a first surface and movably disposed within said platen movable between first and second positions, said first surface being closer to said polishing surface in the second position than in the first position, said window positioned to move intermittently into alignment with the wafer during the polishing operation.