B24D 3/32
For porous or cellular structure
Official title: for porous or cellular structure
B24D3/32 (For porous or cellular structure) appears on 206 US grants and 223 published applications in this corpus.
Search patents in B24D- Granted patents
- 206
- Published applications
- 223
- Assignees
- 102
- Inventors
- 478
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 3 | 0 |
| 1979 | 0 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 4 | 0 |
| 1987 | 1 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 5 | 0 |
| 1991 | 1 | 0 |
| 1992 | 4 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 3 | 0 |
| 1997 | 0 | 0 |
| 1998 | 6 | 0 |
| 1999 | 3 | 0 |
| 2000 | 8 | 0 |
| 2001 | 4 | 2 |
| 2002 | 13 | 10 |
| 2003 | 8 | 19 |
| 2004 | 9 | 20 |
| 2005 | 17 | 24 |
| 2006 | 14 | 12 |
| 2007 | 7 | 10 |
| 2008 | 5 | 9 |
| 2009 | 3 | 15 |
| 2010 | 2 | 10 |
| 2011 | 6 | 7 |
| 2012 | 7 | 8 |
| 2013 | 11 | 7 |
| 2014 | 9 | 4 |
| 2015 | 5 | 10 |
| 2016 | 5 | 4 |
| 2017 | 3 | 3 |
| 2018 | 3 | 5 |
| 2019 | 6 | 10 |
| 2020 | 3 | 3 |
| 2021 | 2 | 6 |
| 2022 | 2 | 4 |
| 2023 | 6 | 11 |
| 2024 | 1 | 6 |
| 2025 | 4 | 2 |
| 2026 | 3 | 2 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Abrasive articles and method of making the same19 May 2026US 12,629,798 B23M Innovative Properties Company
- Method of making low specific gravity polishing pads10 Feb 2026US 12,544,958 B2Rohm and Haas Electronic Materials CMP Holdings, Inc.
- CMP pad having ultra expanded polymer microspheres20 Jan 2026US 12,528,152 B2Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Textured CMP pad comprising polymer particles18 Nov 2025US 12,472,602 B2CMC Materials, Inc.
- Chemical-mechanical polishing subpad having porogens with polymeric shells4 Nov 2025US 12,459,076 B2CMC Materials, Inc.
- Abrasive articles and method of making the same20 Aug 2026US 2026/0241515 A13M Innovative Properties Company
- Polishing method and method for producing semiconductor component11 Jun 2026US 2026/0158611 A1AGC Inc.
- Polishing pad, polishing pad manufacturing method, and wafer polishing method5 Jun 2025US 2025/0178154 A1Noritake Co., Limited
- Cmp polishing pad23 Jan 2025US 2025/0025983 A1
- Abrasive articles and methods for forming same19 Sep 2024US 2024/0309254 A1Saint-Gobain Abrasifs
Most cited
By later US patents
- Erodable agglomerates and abrasive products containing the same362US 4,652,275 AMinnesota Mining and Manufacturing Company · 1987
- Polymeric polishing pad containing hollow polymeric microelements245US 5,578,362 ARodel, Inc. · 1996
- Pad material for grinding, lapping and polishing139US 4,927,432 ARodel, Inc. · 1990
- Polishing pad for semiconductor wafers128US 4,954,141 AChiyoda Kaushiki Kaisha · 1990
- Abrasive articles comprising a fluorochemical agent for wafer surface modification124US 6,121,143 A3M Innovative Properties Company · 2000