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US 12,472,602 B2Granted
Textured CMP pad comprising polymer particles
AssigneeCMC Materials, Inc.
InventorsRui Ma, Kaiting Li, Jessica Tabert, Sangcheol Kim, Satish Rai
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Abstract
A chemical mechanical polishing pad comprising a polishing portion, the polishing portion comprising: a polymeric body; a plurality of polymer particles embedded within the body of the polymeric body, wherein at least a portion of the plurality of polymer particles is at least partially exposed at a surface of the polymeric body; and a plurality of pores at the surface of the polymeric body.
Claims13
A chemical mechanical polishing pad comprising a polishing portion, the polishing portion comprising:
- a polymeric body having a polishing surface;
- a plurality of solid, rigid polymer particles embedded within the body of the polymeric body, wherein at least a portion of the plurality of polymer particles is at least partially exposed at the polishing surface of the polymeric body, the exposed portion of the polymer particles protruding from the polishing surface of the polymeric body;
- and
- a plurality of pores at the polishing surface of the polymeric body,
- wherein an average surface roughness (Sa) of the polishing surface of the ranges from 5.32 μm to 8.02 μm.
2 more elements
A method of producing a polishing pad comprising:
- preparing a first mixture comprising a prepolymer;
- preparing or obtaining a first curative comprising polymer particles;
- preparing a second mixture by combining the first curative comprising the
- polymer particles with a second curative;
- combining the first mixture and the second mixture;
- transferring the combined first and second mixtures into a mold;
- and initiating a polymerization reaction in the mold to form a polymeric body of a polishing portion of the chemical mechanical polishing pad, the polymeric body comprising a plurality of solid, rigid polymer particles embedded within the body of the polymeric body, wherein at least a portion of the plurality of polymer particles is at least partially exposed at a polishing surface of the polymeric body together with a plurality of pores at the polishing surface of the polymeric body, the exposed portions of the polymer particles protruding from the polishing surface of the polymeric body and wherein an average surface roughness (Sa) of the polishing surface of the ranges from 5.32 μm to 8.02 μm.
4 more elements
Dependencies are inferred from the claim text.