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US 4,954,141 AGranted
Polishing pad for semiconductor wafers
AssigneesShowa Denko K.K., Chiyoda Kaushiki Kaisha
InventorsMasahiro Takiyama, Kunihiro Miyazaki, Kenichiro Shiozawa
Life of this patent
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Abstract
A polishing pad for a semiconductor wafer, which pad is made of a foamed fluorine-contained resin sheet and is highly resistant to a corrosive polishing solution such as bromine-methanol system or bromine-methanol-silica powder system.
Claims6
A polishing pad for obtaining a mirror-like surface of a semiconductor wafer, said pad comprising a sheet of foamed fluorine-containing resin, wherein said pad of said foamed fluorine-containing resin has an average pore size of 10 to 2000 .mu.m and porosity of 60 to 95%.
Dependencies are inferred from the claim text.