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US 12,459,076 B2Granted
Chemical-mechanical polishing subpad having porogens with polymeric shells
AssigneeCMC Materials, Inc.
InventorsDustin Miller, Paul Andre Lefevre, Aaron Peterson, Chen-Chih Tsai
Life of this patent
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Abstract
A subpad for a chemical-mechanical polishing pad, the subpad having porogens with polymeric shells. Methods of fabricating the subpad and polishing pads with a polishing surface layer bonded to the subpad layer are also described.
Claims8
A chemical-mechanical polishing pad comprising:
- a subpad supporting a top pad, the subpad comprising a thermoset polyurethane body and a plurality of porogens distributed within the thermoset polyurethane body, the porogens comprising polymeric shells wherein the polymeric shells comprise a material selected from the group consisting of a block copolymer, polyvinylidene chloride, acrylonitrile, and acrylic materials, wherein the subpad has a density of about 150 kg/m3 to about 900 kg/m3 and a compression force deflection of about 25% between 5 psi and 200 psi;
- and
- a top pad having a polishing surface, wherein the top pad is adhered to the subpad with an adhesive.
Dependencies are inferred from the claim text.