B24B 49/08
Involving liquid or pneumatic means
Official title: involving liquid or pneumatic means
B24B49/08 (Involving liquid or pneumatic means) appears on 83 US grants and 92 published applications in this corpus.
Search patents in B24B- Granted patents
- 83
- Published applications
- 92
- Assignees
- 51
- Inventors
- 179
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 2 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 3 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 1 |
| 2004 | 0 | 1 |
| 2005 | 0 | 1 |
| 2006 | 3 | 2 |
| 2007 | 2 | 7 |
| 2008 | 2 | 3 |
| 2009 | 3 | 4 |
| 2010 | 3 | 4 |
| 2011 | 3 | 4 |
| 2012 | 1 | 3 |
| 2013 | 4 | 1 |
| 2014 | 1 | 7 |
| 2015 | 3 | 5 |
| 2016 | 6 | 4 |
| 2017 | 3 | 6 |
| 2018 | 3 | 7 |
| 2019 | 6 | 4 |
| 2020 | 4 | 6 |
| 2021 | 4 | 4 |
| 2022 | 3 | 6 |
| 2023 | 3 | 4 |
| 2024 | 6 | 5 |
| 2025 | 3 | 2 |
| 2026 | 3 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Surface property measuring system, surface property measuring method, polishing apparatus, and polishing method11 Aug 2026US 12,703,058 B2Ebara Corporation
- Force overshoot and other pressure disturbance mitigation in pneumatic force control devices21 Apr 2026US 12,605,849 B2ATI Industrial Automation, Inc.
- Method of monitoring a vibratory grinding process10 Mar 2026US 12,569,958 B2Röster Holding GmbH
- Grinding method of workpiece10 Jun 2025US 12,325,104 B2Disco Corporation
- Jig for mounting and dismounting processing tool20 May 2025US 12,304,025 B2Disco Corporation
- Device For Grinding A Workpiece And/Or Dressing A Tool16 Jul 2026US 2026/0200037 A1Reishauer AG
- Electrical connection for chemical mechanical polishing carrier head28 Aug 2025US 2025/0269488 A1
- Substrate holding apparatus, substrate suction determination method, substrate polishing apparatus, substrate polishing method, method of removing liquid from upper surface of wafer to be polished, elastic film for pressing wafer against polishing pad, substrate release method, and constant amount gas supply apparatus1 May 2025US 2025/0140594 A1Ebara Corporation
- Method of inflating elastic membrane of polishing head, and polishing head system29 Aug 2024US 2024/0286246 A1Ebara Corporation
- Attachment and handling device with an attachment27 Jun 2024US 2024/0208781 A1Schwamborn Geraetebau GmbH
Most cited
By later US patents
- Apparatus for accurately measuring local thickness of insulating layer on semiconductor wafer during polishing and polishing system using the same62US 6,322,422 B1NEC Corporation · 2001
- Substrate thickness measuring during polishing43US 7,409,260 B2APPLIED Materials.Inc. · 2008
- Spectrum based endpointing for chemical mechanical polishing38US 7,764,377 B2APPLIED Materials.Inc. · 2010
- Arrangement for measuring the diameter of cylindrical parts during the machining thereof31US 5,150,545 AMeseltron S. A. · 1992
- Spectra based endpointing for chemical mechanical polishing29US 7,406,394 B2APPLIED Materials.Inc. · 2008